Rev. 3.2

July 2001

1/100

ST6200C/ST6201C/ST6203C

8-BIT MCUs WITH A/D CONVERTER,

TWO TIMERS, OSCILLATOR SAFEGUARD & SAFE RESET

Memories

1K or 2K bytes Program memory (OTP,

EPROM, FASTROM or ROM) with read-out
protection

64 bytes RAM

Clock, Reset and Supply Management
Enhanced reset system
Low Voltage Detector (LVD) for Safe Reset
Clock sources: crystal/ceramic resonator or

RC network, external clock, backup oscillator
(LFAO)

Oscillator Safeguard (OSG)
2 Power Saving Modes: Wait and Stop

Interrupt Management
4 interrupt vectors plus NMI and RESET
9 external interrupt lines (on 2 vectors)

9 I/O Ports
9 multifunctional bidirectional I/O lines
4 alternate function lines
3 high sink outputs (20mA)

2 Timers
Configurable watchdog timer
8-bit timer/counter with a 7-bit prescaler

Analog Peripheral
8-bit ADC with 4 input channels (except on

ST6203C)

Instruction Set

8-bit data manipulation
40 basic instructions
9 addressing modes
Bit manipulation

Development Tools

Full hardware/software development package

Device Summary

(See

Section 11.5

for Ordering Information)

PDIP16

SO16

CDIP16W

SSOP16

Features

ST62T00C(OTP)

ST6200C(ROM)

ST62P00C(FASTROM)

ST62T01C(OTP)

ST6201C(ROM)

ST62P01C(FASTROM)

ST62T03C(OTP)

ST6203C(ROM)

ST62P03C(FASTROM)

ST62E01C(EPROM)

Program memory - bytes

RAM - bytes

Operating Supply

3.0V to 6V

Analog Inputs

Clock Frequency

8MHz Max

Operating Temperature

-40°C to +125°C

Packages

PDIP16 / SO16 / SSOP16

CDIP16W

Table of Contents

100

2/100

ST6200C/ST6201C/ST6203C . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 MEMORY MAPS, PROGRAMMING MODES AND OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . 8

3.1

MEMORY AND REGISTER MAPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1.2 Program Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3 Readout Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.4 Data Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.5 Stack Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.6 Data ROM Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.2

PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.2.1 Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2.2 EPROM Erasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.3

OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1

INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.2

MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.3

CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

5 CLOCKS, SUPPLY AND RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1

CLOCK SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1.1 Main Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1.2 Oscillator Safeguard (OSG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1.3 Low Frequency Auxiliary Oscillator (LFAO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1.4 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5.2

LOW VOLTAGE DETECTOR (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.3

RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3.2 RESET Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3.3 RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.3.4 Watchdog Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3.5 LVD Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.4

INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

5.5

INTERRUPT RULES AND PRIORITY MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.6

INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.7

NON MASKABLE INTERRUPT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.8

PERIPHERAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.9

EXTERNAL INTERRUPTS (I/O PORTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

5.9.1 Notes on using External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

5.10 INTERRUPT HANDLING PROCEDURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5.10.1Interrupt Response Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5.11 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Table of Contents

3/100

6 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6.1

INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6.2

WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

6.3

STOP MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

6.4

NOTES RELATED TO WAIT AND STOP MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

6.4.1 Exit from Wait and Stop Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.4.2 Recommended MCU Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

7 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.1

INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.2

FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.2.1 Digital Input Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.2.2 Analog Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.2.3 Output Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.2.4 Alternate Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.2.5 Instructions NOT to be used to access Port Data registers (SET, RES, INC and DEC)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.2.6 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.3

LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.4

INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.5

8 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

8.1

WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

8.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.1.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.1.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.1.4 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.1.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.1.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.1.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

8.2

8-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

8.2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.2.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.2.3 Counter/Prescaler Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.2.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.2.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.2.6 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

8.3

A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

8.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.3.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.3.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
8.3.4 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
8.3.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
8.3.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
8.3.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table of Contents

100

4/100

9 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

9.1

ST6 ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

9.2

ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

9.3

INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

10 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

10.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

10.1.1Minimum and Maximum Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
10.1.2Typical Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
10.1.3Typical Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
10.1.4Loading Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
10.1.5Pin Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

10.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

10.2.1Voltage Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
10.2.2Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
10.2.3Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

10.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

10.3.1General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
10.3.2Operating Conditions with Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . . 61

10.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

10.4.1RUN Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
10.4.2WAIT Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
10.4.3STOP Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
10.4.4Supply and Clock System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
10.4.5On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

10.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

10.5.1General Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10.5.2External Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10.5.3Crystal and Ceramic Resonator Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
10.5.4RC Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
10.5.5Oscillator Safeguard (OSG) and Low Frequency Auxiliary Oscillator (LFAO) . . . . . 71

10.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

10.6.1RAM and Hardware Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
10.6.2EPROM Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

10.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

10.7.1Functional EMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
10.7.2Absolute Electrical Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
10.7.3ESD Pin Protection Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

10.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

10.8.1General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
10.8.2Output Driving Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

10.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

10.9.1Asynchronous RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
10.9.2NMI Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

10.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

10.10.1Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.10.28-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Table of Contents

5/100

10.11 8-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

11 GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

11.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

11.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

11.3 SOLDERING AND GLUEABILITY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

11.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

11.5 ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

11.6 TRANSFER OF CUSTOMER CODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

11.6.1FASTROM version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
11.6.2ROM VERSION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

12 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

13 ST6 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

14 SUMMARY OF CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

15 TO GET MORE INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

ST6200C/ST6201C/ST6203C

6/100

1 INTRODUCTION

The ST6200C, 01C and 03C devices are low cost
members of the ST62xx 8-bit HCMOS family of mi-
crocontrollers, which is targeted at low to medium
complexity applications. All ST62xx devices are
based on a building block approach: a common
core is surrounded by a number of on-chip periph-
erals.

The ST62E01C is the erasable EPROM version of
the ST62T00C, T01 and T03C devices, which may
be used during the development phase for the
ST62T00C, T01 and T03C target devices, as well
as the respective ST6200C, 01C and 03C ROM
devices.

OTP and EPROM devices are functionally identi-
cal. OTP devices offer all the advantages of user
programmability at low cost, which make them the
ideal choice in a wide range of applications where
frequent code changes, multiple code versions or
last minute programmability are required.

The ROM based versions offer the same function-
ality, selecting the options defined in the program-

mable option bytes of the OTP/EPROM versions
in the ROM option list (See

Section 11.6 on page

The ST62P00C, P01C and P03C are the Factory
Advanced Service Technique ROM (FASTROM)
versions of ST62T00C, T01 and T03C OTP devic-
es.

They offer the same functionality as OTP devices,
but they do not have to be programmed by the
customer (See

Section 11 on page 86

These compact low-cost devices feature a Timer
comprising an 8-bit counter with a 7-bit program-
mable prescaler, an 8-bit A/D Converter with 4 an-
alog inputs (depending on device, see device
summary on page 1) and a Digital Watchdog tim-
er, making them well suited for a wide range of au-
tomotive, appliance and industrial applications.

For easy reference, all parametric data are located
in

Section 10 on page 58

Figure 1. Block Diagram

NMI

INTERRUPTS

PROGRAM

STACK LEVEL 1

STACK LEVEL 2

STACK LEVEL 3

STACK LEVEL 4

STACK LEVEL 5

STACK LEVEL 6

POWER
SUPPLY

OSCILLATOR

RESET

DATA ROM

USER

SELECTABLE

DATA RAM

64 Bytes

PORT A

PORT B

TIMER

8-BIT CORE

8-BIT *

A/D CONVERTER

PA1..PA3 (20mA Sink)

PB0..PB1

OSCin OSCout

RESET

WATCHDOG

MEMORY

TIMER

(1K or 2K Bytes)

PB3, PB5..PB7 / Ain*

* Depending on device. Please refer to I/O Port section.

ST6200C/ST6201C/ST6203C

7/100

2 PIN DESCRIPTION

Figure 2. 16-Pin Package Pinout

Table 1. Device Pin Description

Legend / Abbreviations for

Table 1

* Depending on device. Please refer to I/O Port section.

I = input, O = output, S = supply, IPU = input pull-up

The input with pull-up configuration (reset state) is valid as long as the user software does not change it.

Refer to

Section 7 "I/O PORTS" on page 36

for more details on the software configuration of the I/O ports.

PB5/Ain*

Ain*/PB6

Ain*/PB7

RESET

NMI

OSCout

OSCin

PB3/Ain*

PB1

PB0

PA3/20mA Sink

PA2/20mA Sink

PA1/20mA Sink

it2

it1

itX associated interrupt vector

* Depending on device. Please refer to I/O Port section.

it2

Pin n°

Pin Name

Typ

Main Function

(after Reset)

Alternate Function

1 V

Main power supply

OSCin

External clock input or resonator oscillator inverter input

OSCout

Resonator oscillator inverter output or resistor input for RC oscillator

NMI

Non maskable interrupt (falling edge sensitive)

Must be held at Vss for normal operation, if a 12.5V level is applied to the pin
during the reset phase, the device enters EPROM programming mode.

RESET

I/O Top priority non maskable interrupt (active low)

PB7/Ain*

I/O Pin B7 (IPU)

Analog input

PB6/Ain*

I/O Pin B6 (IPU)

Analog input

PB5/Ain*

I/O Pin B5 (IPU)

Analog input

PB3/Ain*

I/O Pin B3 (IPU)

Analog input

PB1

I/O Pin B1 (IPU)

PB0

I/O Pin B0 (IPU)

PA3/ 20mA Sink

I/O Pin A3 (IPU)

PA2/ 20mA Sink

I/O Pin A2 (IPU)

PA1/ 20mA Sink

I/O Pin A1 (IPU)

S Ground

ST6200C/ST6201C/ST6203C

10/100

MEMORY MAP (Cont'd)

3.1.2 Program Space

Program Space comprises the instructions to be
executed, the data required for immediate ad-
dressing mode instructions, the reserved factory
test area and the user vectors. Program Space is
addressed via the 12-bit Program Counter register
(PC register). Thus, the MCU is capable of ad-
dressing 4K bytes of memory directly.

3.1.3 Readout Protection

The Program Memory in in OTP, EPROM or ROM
devices can be protected against external readout
of memory by setting the Readout Protection bit in
the option byte (

Section 3.3 on page 15

In the EPROM parts, Readout Protection option
can be desactivated only by U.V. erasure that also
results in the whole EPROM context being erased.

Note: Once the Readout Protection is activated, it
is no longer possible, even for STMicroelectronics,
to gain access to the OTP or ROM contents. Re-
turned parts can therefore not be accepted if the
Readout Protection bit is set.

3.1.4 Data Space

Data Space accommodates all the data necessary
for processing the user program. This space com-
prises the RAM resource, the processor core and
peripheral registers, as well as read-only data

such as constants and look-up tables in OTP/
EPROM.

3.1.4.1 Data ROM

All read-only data is physically stored in program
memory, which also accommodates the Program
Space. The program memory consequently con-
tains the program code to be executed, as well as
the constants and look-up tables required by the
application.

The Data Space locations in which the different
constants and look-up tables are addressed by the
processor core may be thought of as a 64-byte
window through which it is possible to access the
read-only data stored in OTP/EPROM.

3.1.4.2 Data RAM

The data space includes the user RAM area, the
accumulator (A), the indirect registers (X), (Y), the
short direct registers (V), (W), the I/O port regis-
ters, the peripheral data and control registers, the
interrupt option register and the Data ROM Win-
dow register (DRWR register).

3.1.5 Stack Space

Stack space consists of six 12-bit registers which
are used to stack subroutine and interrupt return
addresses, as well as the current program counter
contents.

ST6200C/ST6201C/ST6203C

11/100

MEMORY MAP (Cont'd)

Table 2. Hardware Register Map

Legend:
x = undefined, R/W = Read/Write, Ro = Read-only Bit(s) in the register, Wo = Write-only Bit(s)
in the register.
Notes:
1. The contents of the I/O port DR registers are readable only in output configuration. In input configura-
tion, the values of the I/O pins are returned instead of the DR register contents.
2. The bits associated with unavailable pins must always be kept at their reset value.
3. Do not use single-bit instructions (SET, RES...) on Port Data Registers if any pin of the port is configured
in input mode (refer to

Section 7 "I/O PORTS" on page 36

for more details).

4. Depending on device. See device summary on page 1.

Address

Block

Register

Label

Register Name

Reset

Status

Remarks

080h

to 083h

CPU

X,Y,V,W

X,Y index registers
V,W short direct registers

xxh

R/W

0C0h
0C1h

I/O Ports

DRA

1) 2) 3)

DRB

1) 2) 3)

Port A Data Register
Port B Data Register

00h
00h

R/W
R/W

0C2h
0C3h

Reserved (2 Bytes)

0C4h
0C5h

I/O Ports

DDRA

DDRB

Port A Direction Register
Port B Direction Register

00h
00h

R/W
R/W

0C6h
0C7h

Reserved (2 Bytes)

0C8h

CPU

IOR

Interrupt Option Register

xxh

Write-only

0C9h

ROM

DRWR

Data ROM Window register

xxh

Write-only

0CAh
0CBh

Reserved (2 Bytes)

0CCh
0CDh

I/O Ports

ORA

ORB

Port A Option Register
Port B Option Register

00h
00h

R/W
R/W

0CEh
0CFh

Reserved (2 bytes)

0D0h
0D1h

ADC

ADR
ADCR

A/D Converter Data Register
A/D Converter Control Register

xxh

40h

Read-only
Ro/Wo

0D2h
0D3h
0D4h

Timer 1

PSCR
TCR
TSCR

Timer 1 Prescaler Register
Timer 1 Downcounter Register
Timer 1 Status Control Register

7Fh

0FFh

00h

R/W
R/W
R/W

0D5h

to 0D7h

Reserved (3 Bytes)

0D8h

Watchdog

Timer

WDGR

Watchdog Register

0FEh

R/W

0D9h

to 0FEh

Reserved (38 Bytes)

0FFh

CPU

Accumulator

xxh

R/W

ST6200C/ST6201C/ST6203C

12/100

MEMORY MAP (Cont'd)

3.1.6 Data ROM Window

The Data read-only memory window is located
from address 0040h to address 007Fh in Data
space. It allows direct reading of 64 consecutive
bytes located anywhere in program memory, be-
tween address 0000h and 0FFFh.

There are 64 blocks of 64 bytes in a 4K device:

Block 0 is related to the address range 0000h to

003Fh.

Block 1 is related to the address range 0040h to

007Fh.

and so on...

All the program memory can therefore be used to
store either instructions or read-only data. The
Data ROM window can be moved in steps of 64
bytes along the program memory by writing the
appropriate code in the Data ROM Window Regis-
ter (DRWR).

Figure 5. Data ROM Window

3.1.6.1 Data ROM Window Register (DRWR)

The DRWR can be addressed like any RAM loca-
tion in the Data Space.

This register is used to select the 64-byte block of
program memory to be read in the Data ROM win-
dow (from address 40h to address 7Fh in Data
space). The DRWR register is not cleared on re-
set, therefore it must be written to before access-
ing the Data read-only memory window area for
the first time.

Address: 0C9h

Write Only

Reset Value = xxh (undefined)

Bits 7:6 = Reserved, must be cleared.

Bit 5:0 = DRWR[5:0]

Data read-only memory Win-

dow Register Bits.

These are the Data read-only

memory Window bits that correspond to the upper
bits of the data read-only memory space.

Caution:

This register is undefined on reset, it is

write-only, therefore do not read it nor access it us-
ing Read-Modify-Write instructions (SET, RES,
INC and DEC).

0000h

0FFFh

000h

040h

07Fh

0FFh

DATA ROM

WINDOW

DATA SPACE

64-BYTE

ROM

PROGRAM

SPACE

DRWR5 DRWR4 DRWR3 DRWR2 DRWR1 DRWR0

ST6200C/ST6201C/ST6203C

13/100

MEMORY MAP (Cont'd)

3.1.6.2 Data ROM Window memory addressing

In cases where some data (look-up tables for ex-
ample) are stored in program memory, reading
these data requires the use of the Data ROM win-
dow mechanism. To do this:

1. The DRWR register has to be loaded with the
64-byte block number where the data are located
(in program memory). This number also gives the
start address of the block.

2. Then, the offset address of the byte in the Data
ROM Window (corresponding to the offset in the
64-byte block in program memory) has to be load-
ed in a register (A, X,...).

When the above two steps are completed, the
data can be read.

To understand how to determine the DRWR and
the content of the register, please refer to the ex-
ample shown in

Figure 6

. In any case the calcula-

tion is automatically handled by the ST6 develop-
ment tools.

Please refer to the user manual of the correspod-
ing tool.

3.1.6.3 Recommendations

Care is required when handling the DRWR regis-
ter as it is write only. For this reason, the DRWR
contents should not be changed while executing
an interrupt service routine, as the service routine
cannot save and then restore the register's previ-
ous contents. If it is impossible to avoid writing to
the DRWR during the interrupt service routine, an
image of the register must be saved in a RAM lo-
cation, and each time the program writes to the
DRWR, it must also write to the image register.
The image register must be written first so that, if
an interrupt occurs between the two instructions,
the DRWR is not affected.

Figure 6. Data ROM Window Memory Addressing

DATA

PROGRAM SPACE

DATA SPACE

0000h

0400h

0421h

07FFh

64 bytes

OFFSET

000h

040h

061h

07Fh

OFFSET
21h

0FFh

DRWR

DATA address in Program memory : 421h
DRWR content : 421h / 3Fh (64) = 10H data is located in 64-bytes window number 10h
64-byte window start address : 10h x 3Fh = 400h
Register (A, X,...)content : Offset = (421h - 400h) + 40h ( Data ROM Window start address in data space) = 61h

10h

DATA

ST6200C/ST6201C/ST6203C

14/100

3.2 PROGRAMMING MODES

3.2.1 Program Memory

EPROM/OTP programming mode is set by a
+12.5V voltage applied to the TEST/V

pin. The

programming flow of the ST62T00C, T01/E01C
and T03C is described in the User Manual of the
EPROM Programming Board.

Table 3. ST6200C/03C Program Memory Map

Table 4. ST6201C Program Memory Map

Note: OTP/EPROM devices can be programmed
with the development tools available from
STMicroelectronics (please refer to

Section 12 on

page 95

3.2.2 EPROM Erasing

The EPROM devices can be erased by exposure
to Ultra Violet light. The characteristics of the MCU
are such that erasure begins when the memory is
exposed to light with a wave lengths shorter than
approximately 4000Å. It should be noted that sun-
light and some types of fluorescent lamps have
wavelengths in the range 3000-4000Å.

It is thus recommended that the window of the
MCU packages be covered by an opaque label to
prevent unintentional erasure problems when test-
ing the application in such an environment.

The recommended erasure procedure is exposure
to short wave ultraviolet light which have a wave-
length 2537Å. The integrated dose (i.e. U.V. inten-
sity x exposure time) for erasure should be a mini-
mum of 30W-sec/cm

. The erasure time with this

dosage is approximately 30 to 40 minutes using an
ultraviolet lamp with 12000µW/cm

power rating.

The EPROM device should be placed within
2.5cm (1inch) of the lamp tubes during erasure.

Device Address

Description

0000h-0B9Fh

0BA0h-0F9Fh
0FA0h-0FEFh

0FF0h-0FF7h

0FF8h-0FFBh

0FFCh-0FFDh

0FFEh-0FFFh

Reserved

User ROM

Reserved

Interrupt Vectors

Reserved

NMI Interrupt Vector

Reset Vector

Device Address

Description

0000h-087Fh
0880h-0F9Fh

0FA0h-0FEFh

0FF0h-0FF7h

0FF8h-0FFBh

0FFCh-0FFDh

0FFEh-0FFFh

Reserved

User ROM

Reserved

Interrupt Vectors

Reserved

NMI Interrupt Vector

Reset Vector

ST6200C/ST6201C/ST6203C

15/100

3.3 OPTION BYTES

Each device is available for production in user pro-
grammable versions (OTP) as well as in factory
coded versions (ROM). OTP devices are shipped
to customers with a default content (00h), while
ROM factory coded parts contain the code sup-
plied by the customer. This implies that OTP de-
vices have to be configured by the customer using
the Option Bytes while the ROM devices are facto-
ry-configured.

The two option bytes allow the hardware configu-
ration of the microcontroller to be selected.
The option bytes have no address in the memory
map and can be accessed only in programming
mode (for example using a standard ST6 program-
ming tool).
In masked ROM devices, the option bytes are
fixed in hardware by the ROM code (see

Section

11.6.2 "ROM VERSION" on page 93

). It is there-

fore impossible to read the option bytes.

The option bytes can be only programmed once. It
is not possible to change the selected options after
they have been programmed.

In order to reach the power consumption value in-
dicated in

Section 10.4

, the option byte must be

programmed to its default value. Otherwise, an
over-consumption will occur.

MSB OPTION BYTE

Bits 15:11 = Reserved, must be always cleared.

Bit 10 = Reserved, must be always set.

Bit 9 = EXTCNTL

External STOP MODE control.

0: EXTCNTL mode not available. STOP mode is

not available with the watchdog active.

1: EXTCNTL mode available. STOP mode is avail-

able with the watchdog active by setting NMI pin
to one.

Bit 8 = LVD

Low Voltage Detector

on/off

This option bit enable or disable the Low Voltage
Detector (LVD) feature.

0: Low Voltage Detector disabled
1: Low Voltage Detector enabled.

LSB OPTION BYTE

Bit 7 = PROTECT

Readout Protection.

This option bit enables or disables external access
to the internal program memory.
0: Program memory not read-out protected
1: Program memory read-out protected

Bit 6 = OSC

Oscillator selection

This option bit selects the main oscillator type.
0: Quartz crystal, ceramic resonator or external

clock

1: RC network

Bit 5 = Reserved, must be always cleared.

Bit 4 = Reserved, must be always set.

Bit 3 = NMI PULL

NMI Pull-Up

on/off.

This option bit enables or disables the internal pull-
up on the NMI pin.
0: Pull-up disabled
1: Pull-up enabled

Bit 2 = Reserved, must be always set.

Bit 1 = WDACT

Hardware or software watchdog.

This option bit selects the watchdog type.
0: Software (watchdog to be enabled by software)
1: Hardware (watchdog always enabled)

Bit 0 = OSGEN

Oscillator Safeguard

on/off.

This option bit enables or disables the oscillator
Safeguard (OSG) feature.
0: Oscillator Safeguard disabled
1: Oscillator Safeguard enabled

MSB OPTION BYTE

LSB OPTION BYTE

Reserved

EXT
CTL

LVD

PRO-

TECT

OSC Res.

Res.

NMI

PULL

Res.

ACT

OSG

Default

Value

ST6200C/ST6201C/ST6203C

16/100

4 CENTRAL PROCESSING UNIT

4.1 INTRODUCTION

The CPU Core of ST6 devices is independent of the
I/O or Memory configuration. As such, it may be
thought of as an independent central processor
communicating with on-chip I/O, Memory and Pe-
ripherals via internal address, data, and control
buses.

4.2 MAIN FEATURES

40 basic instructions

9 main addressing modes

Two 8-bit index registers

Two 8-bit short direct registers

Low power modes

Maskable hardware interrupts

6-level hardware stack

4.3 CPU REGISTERS

The ST6 Family CPU core features six registers and
three pairs of flags available to the programmer.
These are described in the following paragraphs.

Accumulator (A). The accumulator is an 8-bit
general purpose register used in all arithmetic cal-
culations, logical operations, and data manipula-

tions. The accumulator can be addressed in Data
Space as a RAM location at address FFh. Thus
the ST6 can manipulate the accumulator just like
any other register in Data Space.

Index Registers (X, Y). These two registers are
used in Indirect addressing mode as pointers to
memory locations in Data Space. They can also
be accessed in Direct, Short Direct, or Bit Direct
addressing modes. They are mapped in Data
Space at addresses 80h (X) and 81h (Y) and can
be accessed like any other memory location.

Short Direct Registers (V, W). These two regis-
ters are used in Short Direct addressing mode.
This means that the data stored in V or W can be
accessed with a one-byte instruction (four CPU cy-
cles). V and W can also be accessed using Direct
and Bit Direct addressing modes. They are
mapped in Data Space at addresses 82h (V) and
83h (W) and can be accessed like any other mem-
ory location.

Note: The X and Y registers can also be used as
Short Direct registers in the same way as V and W.

Program Counter (PC). The program counter is a
12-bit register which contains the address of the
next instruction to be executed by the core. This
ROM location may be an opcode, an operand, or
the address of an operand.

Figure 7. CPU Registers

ACCUMULATOR

X INDEX REGISTER

Y INDEX REGISTER

PROGRAM COUNTER

RESET VALUE = RESET VECTOR @ 0FFEh-0FFFh

RESET VALUE = xxh

x = Undefined value

V SHORT INDIRECT

RESET VALUE = xxh

W SHORT INDIRECT

RESET VALUE = xxh

NORMAL FLAGS

CNMI ZNMI

INTERRUPT FLAGS

NMI FLAGS

SIX LEVEL

STACK

ST6200C/ST6201C/ST6203C

17/100

CPU REGISTERS (Cont'd)

The 12-bit length allows the direct addressing of
4096 bytes in Program Space.

However, if the program space contains more than
4096 bytes, the additional memory in program
space can be addressed by using the Program
ROM Page register.

The PC value is incremented after reading the ad-
dress of the current instruction. To execute relative
jumps, the PC and the offset are shifted through
the ALU, where they are added; the result is then
shifted back into the PC. The program counter can
be changed in the following ways:

JP (Jump) instruction

PC = Jump address

CALL instruction

PC = Call address

Relative Branch InstructionPC = PC +/- offset

Interrupt

PC = Interrupt vector

Reset

PC = Reset vector

RET & RETI instructions

PC = Pop (stack)

Normal instruction

PC = PC + 1

Flags (C, Z). The ST6 CPU includes three pairs of
flags (Carry and Zero), each pair being associated
with one of the three normal modes of operation:
Normal mode, Interrupt mode and Non Maskable
Interrupt mode. Each pair consists of a CARRY
flag and a ZERO flag. One pair (CN, ZN) is used
during Normal operation, another pair is used dur-
ing Interrupt mode (CI, ZI), and a third pair is used
in the Non Maskable Interrupt mode (CNMI, ZN-
MI).

The ST6 CPU uses the pair of flags associated
with the current mode: as soon as an interrupt (or
a Non Maskable Interrupt) is generated, the ST6
CPU uses the Interrupt flags (or the NMI flags) in-
stead of the Normal flags. When the RETI instruc-
tion is executed, the previously used set of flags is
restored. It should be noted that each flag set can
only be addressed in its own context (Non Maska-
ble Interrupt, Normal Interrupt or Main routine).
The flags are not cleared during context switching
and thus retain their status.

C : Carry flag.

This bit is set when a carry or a borrow occurs dur-
ing arithmetic operations; otherwise it is cleared.
The Carry flag is also set to the value of the bit
tested in a bit test instruction; it also participates in
the rotate left instruction.
0: No carry has occured
1: A carry has occured

Z : Zero flag
This flag is set if the result of the last arithmetic or
logical operation was equal to zero; otherwise it is
cleared.
0: The result of the last operation is different from

zero

1: The result of the last operation is zero

Switching between the three sets of flags is per-
formed automatically when an NMI, an interrupt or
a RETI instruction occurs. As NMI mode is auto-
matically selected after the reset of the MCU, the
ST6 core uses the NMI flags first.

Stack. The ST6 CPU includes a true LIFO (Last In
First Out) hardware stack which eliminates the
need for a stack pointer. The stack consists of six
separate 12-bit RAM locations that do not belong
to the data space RAM area. When a subroutine
call (or interrupt request) occurs, the contents of
each level are shifted into the next level down,
while the content of the PC is shifted into the first
level (the original contents of the sixth stack level
are lost). When a subroutine or interrupt return oc-
curs (RET or RETI instructions), the first level reg-
ister is shifted back into the PC and the value of
each level is popped back into the previous level.

Figure 8. Stack manipulation

Since the accumulator, in common with all other
data space registers, is not stored in this stack,
management of these registers should be per-
formed within the subroutine.

Caution: The stack will remain in its "deepest" po-
sition if more than 6 nested calls or interrupts are
executed, and consequently the last return ad-
dress will be lost.

It will also remain in its highest position if the stack
is empty and a RET or RETI is executed. In this
case the next instruction will be executed.

LEVEL 1

LEVEL 2

LEVEL 3

LEVEL 4

LEVEL 5

LEVEL 6

ON
INTERRUPT,
OR
SUBROUTINE
CALL

ON RETURN
FROM
INTERRUPT,
OR
SUBROUTINE

PROGRAM

COUNTER

ST6200C/ST6201C/ST6203C

18/100

5 CLOCKS, SUPPLY AND RESET

5.1 CLOCK SYSTEM

The main oscillator of the MCU can be driven by
any of these clock sources:

external clock signal

external AT-cut parallel-resonant crystal

external ceramic resonator

external RC network (R

NET

In addition, an on-chip Low Frequency Auxiliary
Oscillator (LFAO) is available as a back-up clock
system or to reduce power consumption.

An optional Oscillator Safeguard (OSG) filters
spikes from the oscillator lines, and switches to the
LFAO backup oscillator in the event of main oscil-
lator failure. It also automatically limits the internal
clock frequency (f

INT

) as a function of V

, in order

to guarantee correct operation. These functions
are illustrated in

Figure 10

, and

Figure 11

Table 5

illustrates various possible oscillator con-

figurations using an external crystal or ceramic
resonator, an external clock input, an external re-
sistor (R

NET

), or the lowest cost solution using only

the LFAO.

For more details on configuring the clock options,
refer to the Option Bytes section of this document.

The internal MCU clock frequency (f

INT

) is divided

by 12 to drive the Timer, the Watchdog timer and
the A/D converter, by 13 to drive the CPU core and
the SPI and by 1 or 3 to drive the ARTIMER, as
shown in

Figure 9

With an 8 MHz oscillator, the fastest CPU cycle is
therefore 1.625µs.

A CPU cycle is the smallest unit of time needed to
execute any operation (for instance, to increment
the Program Counter). An instruction may require
two, four, or five CPU cycles for execution.

Figure 9. Clock Circuit Block Diagram

MAIN

OSCILLATOR

OSG

LFAO

CORE

: 13

: 12

8-BIT TIMER

WATCHDOG

INT

OSCOFF BIT

ADC

filtering

OSCILLATOR SAFEGUARD (OSG)

OSG ENABLE OPTION BIT (See OPTION BYTE SECTION)

(ADCR REGISTER)

OSC

* Depending on device. See device summary on page 1.

Oscillator

Divider

SPI

: 1

: 3

8-BIT ARTIMER

ST6200C/ST6201C/ST6203C

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CLOCK SYSTEM (Cont'd)

5.1.1 Main Oscillator

The oscillator configuration is specified by select-
ing the appropriate option in the option bytes (refer
to the Option Bytes section of this document).
When the CRYSTAL/RESONATOR option is se-
lected, it must be used with a quartz crystal, a ce-
ramic resonator or an external signal provided on
the OSCin pin. When the RC NETWORK option is
selected, the system clock is generated by an ex-
ternal resistor (the capacitor is implemented inter-
nally).

The main oscillator can be turned off (when the
OSG ENABLED option is selected) by setting the
OSCOFF bit of the ADC Control Register (not
available on some devices). This will automatically
start the Low Frequency Auxiliary Oscillator
(LFAO).

The main oscillator can be turned off by resetting
the OSCOFF bit of the A/D Converter Control Reg-
ister or by resetting the MCU. When the main os-
cillator starts there is a delay made up of the oscil-
lator start-up delay period plus the duration of the
software instruction at a clock frequency f

LFAO

Caution: It should be noted that when the RC net-
work option is selected, the accuracy of the fre-
quency is about 20% so it may not be suitable for
some applications (For more details, please refer
to the Electrical Characteristics Section).

Table 5. Oscillator Configurations

Notes:
1. To select the options shown in column 1 of the above
table, refer to the Option Byte section.
2.This schematic are given for guidance only and are sub-
ject to the schematics given by the crystal or ceramic res-
onator manufacturer.
3. For more details, please refer to the Electrical Charac-
teristics Section.

Hardware Configuration

Crys

tal/Re

sona

tor O

ption

ystal/

Reso

nator

Optio

Netwo

rk O

ption

SG E

nable

d Op

tion

OSCin

OSCout

EXTERNAL

ST6

CLOCK

External Clock

OSCin

OSCout

LOAD

CAPACITORS

ST6

Crystal/Resonator Clock

OSCin

OSCout

ST6

NET

RC Network

OSCin

OSCout

ST6

LFAO

ST6200C/ST6201C/ST6203C

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CLOCK SYSTEM (Cont'd)

5.1.2 Oscillator Safeguard (OSG)

The Oscillator Safeguard (OSG) feature is a
means of dramatically improving the operational
integrity of the MCU. It is available when the OSG
ENABLED option is selected in the option byte (re-
fer to the Option Bytes section of this document).

The OSG acts as a filter whose cross-over fre-
quency is device dependent and provides three
basic functions:

Filtering spikes on the oscillator lines which

would result in driving the CPU at excessive fre-
quencies

Management of the Low Frequency Auxiliary

Oscillator (LFAO), (useable as low cost internal
clock source, backup clock in case of main oscil-
lator failure or for low power consumption)

Automatically limiting the f

INT

clock frequency as

a function of supply voltage, to ensure correct
operation even if the power supply drops.

5.1.2.1 Spike Filtering

Spikes on the oscillator lines result in an effectively
increased internal clock frequency. In the absence
of an OSG circuit, this may lead to an over fre-
quency for a given power supply voltage. The
OSG filters out such spikes (as illustrated in

Figure

). In all cases, when the OSG is active, the max-

imum internal clock frequency, f

INT

, is limited to

OSG

, which is supply voltage dependent.

5.1.2.2 Management of Supply Voltage
Variations

Over-frequency, at a given power supply level, is
seen by the OSG as spikes; it therefore filters out
some cycles in order that the internal clock fre-
quency of the device is kept within the range the
particular device can stand (depending on V

and below f

OSG

: the maximum authorised frequen-

cy with OSG enabled.

5.1.2.3 LFAO Management

When the OSG is enabled, the Low Frequency
Auxiliary Oscillator can be used (see

Section

5.1.3

Note:

The OSG should be used wherever possible

as it provides maximum security for the applica-
tion. It should be noted however, that it can in-
crease power consumption and reduce the maxi-
mum operating frequency to f

OSG

(see Electrical

Characteristics section).

Caution: Care has to be taken when using the
OSG, as the internal frequency is defined between
a minimum and a maximum value and may vary
depending on both V

and temperature. For pre-

cise timing measurements, it is not recommended
to use the OSG.

Figure 10. OSG Filtering Function

Figure 11. LFAO Oscillator Function

OSC

OSG

INT

OSC<

OSG

OSC>

OSG

MAIN OSCILLATOR

STOPS

MAIN OSCILLATOR

RESTARTS

INTERNAL CLOCK DRIVEN BY LFAO

OSC

INT

LFAO

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CLOCK SYSTEM (Cont'd)

5.1.3 Low Frequency Auxiliary Oscillator

(LFAO)

The Low Frequency Auxiliary Oscillator has three
main purposes. Firstly, it can be used to reduce
power consumption in non timing critical routines.
Secondly, it offers a fully integrated system clock,
without any external components. Lastly, it acts as
a backup oscillator in case of main oscillator fail-
ure.

This oscillator is available when the OSG ENA-
BLED option is selected in the option byte (refer to
the Option Bytes section of this document). In this
case, it automatically starts one of its periods after
the first missing edge of the main oscillator, what-
ever the reason for the failure (main oscillator de-
fective, no clock circuitry provided, main oscillator
switched off...). See

Figure 11

User code, normal interrupts, WAIT and STOP in-
structions, are processed as normal, at the re-
duced f

LFAO

frequency. The A/D converter accura-

cy is decreased, since the internal frequency is be-
low 1.2 MHz.

At power on, until the main oscillator starts, the re-
set delay counter is driven by the LFAO. If the
main oscillator starts before the 2048 or 32768 cy-
cle delay has elapsed, it takes over.

The Low Frequency Auxiliary Oscillator is auto-
matically switched off as soon as the main oscilla-
tor starts.

5.1.4 Register Description

ADC CONTROL REGISTER (ADCR)
Address: 0D1h

Read/Write

Reset value: 0100 0000 (40h)

Bit 7:3, 1:0 = ADCR[7:3], ADCR[1:0]

ADC Control

These bits are used to control the A/D converter (if
available on the device) otherwise they are not
used.

Bit 2 = OSCOFF

Main Oscillator Off.

0: Main oscillator enabled
1: Main oscillator disabled

Note: The OSG must be enabled using the OS-
GEN option in the Option Byte, otherwise the OS-
COFF setting has no effect.

ADCR

OSC

OFF

ADCR

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5.2 LOW VOLTAGE DETECTOR (LVD)

The on-chip Low Voltage Detector is enabled by
setting a bit in the option bytes (refer to the Option
Bytes section of this document).

The LVD allows the device to be used without any
external RESET circuitry. In this case, the RESET
pin should be left unconnected.

If the LVD is not used, an external circuit is manda-
tory to ensure correct Power On Reset operation,
see figure in the Reset section. For more details,
please refer to the application note AN669.

The LVD generates a static Reset when the supply
voltage is below a reference value. This means
that it secures the power-up as well as the power-
down keeping the ST6 in reset.

The V

IT-

reference value for a voltage drop is lower

than the V

IT+

reference value for power-on in order

to avoid a parasitic reset when the MCU starts run-
ning and sinks current on the supply (hysteresis).

The LVD Reset circuitry generates a reset when
V

is below:

IT+

when V

is rising

IT-

when V

is falling

The LVD function is illustrated in

Figure 12

If the LVD is enabled, the MCU can be in only one
of two states:

Over the input threshold voltage, it is running un-

der full software control

Below the input threshold voltage, it is in static

safe reset

In these conditions, secure operation is guaran-
teed without the need for external reset hardware.

During a Low Voltage Detector Reset, the RESET
pin is held low, thus permitting the MCU to reset
other devices.

Figure 12. Low Voltage Detector Reset

IT+

RESET

IT-

hyst

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5.3 RESET

5.3.1 Introduction

The MCU can be reset in three ways:

A low pulse input on the RESET pin

Internal Watchdog reset

Internal Low Voltage Detector (LVD) reset

5.3.2 RESET Sequence

The basic RESET sequence consists of 3 main
phases:

Internal (watchdog or LVD) or external Reset
event

A delay of 2048 or 32768 clock (f

INT

) cycles

(selected through the option bytes)

RESET vector fetch

The reset delay allows the oscillator to stabilise
and ensures that recovery has taken place from
the Reset state.

The RESET vector fetch phase duration is 2 clock
cycles.

When a reset occurs:

The stack is cleared

The PC is loaded with the address of the Reset

vector. It is located in program ROM starting at
address 0FFEh.

A jump to the beginning of the user program must
be coded at this address.

The interrupt flag is automatically set, so that the

CPU is in Non Maskable Interrupt mode. This
prevents the initialization routine from being in-
terrupted. The initialization routine should there-
fore be terminated by a RETI instruction, in order
to go back to normal mode.

Figure 13. RESET Sequence

RESET PIN

WATCHDOG

IT+

IT-

WATCHDOG UNDERFLOW

RESET

2048 CLOCK CYCLE (fINT) DELAY

LVD

RESET

INTERNAL

RUN

RESET

RUN

RESET

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RESET (Cont'd)

5.3.3 RESET Pin

The RESET pin may be connected to a device on
the application board in order to reset the MCU if
required. The RESET pin may be pulled low in
RUN, WAIT or STOP mode. This input can be
used to reset the internal state of the MCU and en-
sure it starts-up correctly. The pin, which is con-
nected to an internal pull-up, is active low and fea-
tures a Schmitt trigger input. A delay (2048 clock
cycles) added to the external signal ensures that
even short pulses on the RESET pin are accepted
as valid, provided V

has completed its rising

phase and that the oscillator is running correctly
(normal RUN or WAIT modes). The MCU is kept in
the Reset state as long as the RESET pin is held
low.

If the RESET pin is grounded while the MCU is in
RUN or WAIT modes, processing of the user pro-
gram is stopped (RUN mode only), the I/O ports
are configured as inputs with pull-up resistors and
the main oscillator is restarted. When the level on
the RESET pin then goes high, the initialization se-
quence is executed at the end of the internal delay
period.

If the RESET pin is grounded while the MCU is in
STOP mode, the oscillator starts up and all the I/O
ports are configured as inputs with pull-up resis-
tors. When the RESET pin level then goes high,
the initialization sequence is executed at the end
of the internal delay period.

A simple external RESET circuitry is shown in

Fig-

ure 15

. For more details, please refer to the appli-

cation note AN669.

Figure 14. Reset Block Diagram

INT

COU

NTER

RESET

WATCHDOG RESET

LVD RESET

INTERNAL

RESET

ESD

1) Resistive ESD protection.

48 o

r
3276

clock cycle

2) The reset delay value is selected through the option bytes.

ST6200C/ST6201C/ST6203C

25/100

RESET (Cont'd)

5.3.4 Watchdog Reset

The MCU provides a Watchdog timer function in
order to be able to recover from software hang-
ups. If the Watchdog register is not refreshed be-
fore an end-of-count condition is reached, a
Watchdog reset is generated.

After a Watchdog reset, the MCU restarts in the
same way as if a Reset was generated by the RE-
SET pin.

Note: When a watchdog reset occurs, the RESET
pin is tied low for very short time period, to flag the
reset phase. This time is not long enough to reset
external circuits.

For more details refer to the Watchdog Timer
chapter.

5.3.5 LVD Reset

Two different RESET sequences caused by the in-
ternal LVD circuitry can be distinguished:

Power-On RESET

Voltage Drop RESET

During an LVD reset, the RESET pin is pulled low
when V

IT+

(rising edge) or V

IT-

(falling

edge).

For more details, refer to the LVD chapter.

Caution: Do not externally connect directly the
RESET pin to V

, this may cause damage to the

component in case of internal RESET (Watchdog
or LVD).

Figure 15. Simple External Reset Circuitry

Figure 16. Reset Processing

ST62xx

RESET

Typical: R = 10K

C = 10nF

R > 4.7 K

INT LATCH CLEARED

NMI MASK SET

(IF PRESENT)

SELECT

NMI MODE FLAGS

IS RESET STILL

PRESENT?

YES

PUT FFEh

ON ADDRESS BUS

FROM RESET LOCATIONS

FFEh/FFFh

FETCH INSTRUCTION

LOAD PC

INTERNAL

RESET

2048 OR 32768
CLOCK CYCLE

DELAY

ST6200C/ST6201C/ST6203C

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5.4 INTERRUPTS

The ST6 core may be interrupted by four maska-
ble interrupt sources, in addition to a Non Maska-
ble Interrupt (NMI) source. The interrupt process-
ing flowchart is shown in

Figure 18

Maskable interrupts must be enabled by setting
the GEN bit in the IOR register. However, even if
they are disabled (GEN bit = 0), interrupt events
are latched and may be processed as soon as the
GEN bit is set.

Each source is associated with a specific Interrupt
Vector, located in Program space (see

Table 7

). In

the vector location, the user must write a Jump in-

struction to the associated interrupt service rou-
tine.

When an interrupt source generates an interrupt
request, the PC register is loaded with the address
of the interrupt vector, which then causes a Jump
to the relevant interrupt service routine, thus serv-
icing the interrupt.

Interrupt are triggered by events either on external
pins, or from the on-chip peripherals. Several
events can be ORed on the same interrupt vector.
On-chip peripherals have flag registers to deter-
mine which event triggered the interrupt.

Figure 17. Interrupts Block Diagram

NMI

ESB BIT

VDD

LATCH

CLEARED BY H/W
AT START OF VECTOR #0 ROUTINE

VECTOR #0

LES BIT

LATCH

CLEARED BY H/W
AT START OF

VECTOR #1

VECTOR #2

VECTOR #3

VECTOR #4

LATCH

CLEARED
BY H/W AT START OF
VECTOR #2 ROUTINE

I/O PORT REGISTER

CONFIGURATION

"INPUT WITH INTERRUPT"

I/O PORT REGISTER

CONFIGURATION

"INPUT WITH INTERRUPT"

EXIT FROM
STOP/WAIT

VECTOR #1 ROUTINE

TIMER

A/D CONVERTER *

TMZ BIT

ETI BIT

EAI BIT

EOC BIT

GEN BIT

PB0..PB1

PA1..PA3

(TSCR REGISTER)

(ADCR REGISTER)

(IOR REGISTER)

PB3
PB5..PB7

* Depending on device. See device summary on page 1.

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5.5 INTERRUPT RULES AND PRIORITY
MANAGEMENT

A Reset can interrupt the NMI and peripheral
interrupt routines

The Non Maskable Interrupt request has the
highest priority and can interrupt any peripheral
interrupt routine at any time but cannot interrupt
another NMI interrupt.

No peripheral interrupt can interrupt another. If
more than one interrupt request is pending,
these are processed by the processor core
according to their priority level: vector #1 has the
highest priority while vector #4 the lowest. The
priority of each interrupt source is fixed by
hardware (see

Interrupt Mapping table

5.6 INTERRUPTS AND LOW POWER MODES

All interrupts cause the processor to exit from
WAIT mode. Only the external and some specific
interrupts from the on-chip peripherals cause the
processor to exit from STOP mode (refer to the
"Exit from STOP" column in the Interrupt Mapping
Table).

5.7 NON MASKABLE INTERRUPT

This interrupt is triggered when a falling edge oc-
curs on the NMI pin regardless of the state of the
GEN bit in the IOR register. An interrupt request
on NMI vector #0 is latched by a flip flop which is
automatically reset by the core at the beginning of
the NMI service routine.

5.8 PERIPHERAL INTERRUPTS

Different peripheral interrupt flags in the peripheral
control registers are able to cause an interrupt
when they are active if both:

The GEN bit of the IOR register is set

The corresponding enable bit is set in the periph-

eral control register.

Peripheral interrupts are linked to vectors #3 and
#4. Interrupt requests are flagged by a bit in their
corresponding control register. This means that a
request cannot be lost, because the flag bit must
be cleared by user software.

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5.9 EXTERNAL INTERRUPTS (I/O Ports)

External interrupt vectors can be loaded into the
PC register if the corresponding external interrupt
occurred and if the GEN bit is set. These interrupts
allow the processor to exit from STOP mode.

The external interrupt polarity is selected through
the IOR register.

External interrupts are linked to vectors #1 and #
2.

Interrupt requests on vector #1 can be configured
either as edge or level-sensitive using the LES bit
in the IOR Register.

Interrupt requests from vector #2 are always edge
sensitive. The edge polarity can be configured us-
ing the ESB bit in the IOR Register.

In edge-sensitive mode, a latch is set when a edge
occurs on the interrupt source line and is cleared
when the associated interrupt routine is started.
So, an interrupt request can be stored until com-
pletion of the currently executing interrupt routine,
before being processed. If several interrupt re-
quests occurs before completion of the current in-
terrupt routine, only the first request is stored.

Storing of interrupt requests is not possible in level
sensitive mode. To be taken into account, the low
level must be present on the interrupt pin when the
MCU samples the line after instruction execution.

5.9.1 Notes on using External Interrupts

ESB bit Spurious Interrupt on Vector #2

If a pin associated with interrupt vector #2 is con-
figured as interrupt with pull-up, whenever vector
#2 is configured to be rising edge sensitive (by set-
ting the ESB bit in the IOR register), an interrupt is
latched although a rising edge may not have oc-
cured on the associated pin.

This is due to the vector #2 circuitry.The worka-
round is to discard this first interrupt request in the
routine (using a flag for example).

Masking of One Interrupt by Another on Vector
#2.

When two or more port pins (associated with inter-
rupt vector #2) are configured together as input
with interrupt (falling edge sensitive), as long as
one pin is stuck at '0', the other pin can never gen-
erate an interrupt even if an active edge occurs at
this pin. The same thing occurs when one pin is
stuck at '1' and interrupt vector #2 is configured as
rising edge sensitive.

To avoid this the first pin must input a signal that
goes back up to '1' right after the falling edge. Oth-
erwise, in the interrupt routine for the first pin, de-
activate the "input with interrupt" mode using the
port control registers (DDR, OR, DR). An active
edge on another pin can then be latched.

I/O port Configuration Spurious Interrupt on

Vector #2

If a pin associated with interrupt vector #2 is in `in-
put with pull-up' state, a `0' level is present on the
pin and the ESB bit = 0, when the I/O pin is config-
ured as interrupt with pull-up by writing to the
DDRx, ORx and DRx register bits, an interrupt is
latched although a falling edge may not have oc-
curred on the associated pin.

In the opposite case, if the pin is in interrupt with
pull-up state , a 0 level is present on the pin and
the ESB bit =1, when the I/O port is configured as
input with pull-up by writing to the DDRx, ORx and
DRx bits, an interrupt is latched although a rising
edge may not have occurred on the associated
pin.

ST6200C/ST6201C/ST6203C

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5.10 INTERRUPT HANDLING PROCEDURE

The interrupt procedure is very similar to a call pro-
cedure, in fact the user can consider the interrupt
as an asynchronous call procedure. As this is an
asynchronous event, the user cannot know the
context and the time at which it occurred. As a re-
sult, the user should save all Data space registers
which may be used within the interrupt routines.
The following list summarizes the interrupt proce-
dure:

When an interrupt request occurs, the following
actions are performed by the MCU automatically:
The core switches from the normal flags to the

interrupt flags (or the NMI flags).

The PC contents are stored in the top level of the

stack.

The normal interrupt lines are inhibited (NMI still

active).

The internal latch (if any) is cleared.
The associated interrupt vector is loaded in the PC.

When an interrupt request occurs, the following
actions must be performed by the user software:
User selected registers have to be saved within

the interrupt service routine (normally on a soft-
ware stack).

The source of the interrupt must be determined

by polling the interrupt flags (if more than one
source is associated with the same vector).

The RETI (RETurn from Interrupt) instruction

must end the interrupt service routine.

After the RETI instruction is executed, the MCU re-
turns to the main routine.

Caution: When a maskable interrupt occurs while
the ST6 core is in NORMAL mode and during the
execution of an "ldi IOR, 00h" instruction (disabling
all maskable interrupts): if the interrupt

request oc-

curs during the first 3 cycles of the "ldi" instruction
(which is a 4-cycle instruction) the core will switch
to interrupt mode BUT the flags CN and ZN will
NOT switch to the interrupt pair CI and ZI.

5.10.1 Interrupt Response Time

This is defined as the time between the moment
when the Program Counter is loaded with the in-
terrupt vector and when the program has jump to
the interrupt subroutine and is ready to execute
the code. It depends on when the interrupt occurs
while the core is processing an instruction.

Figure 18. Interrupt Processing Flow Chart

Table 6. Interrupt Response Time

One CPU cycle is 13 external clock cycles thus 11
CPU cycles = 11 x (13 /8M) = 17.875 µs with an 8
MHz external quartz.

Minimum

6 CPU cycles

Maximum

11 CPU cycles

INSTRUCTION

FETCH

INSTRUCTION

EXECUTE

INSTRUCTION

WAS

THE INSTRUCTION

A RETI ?

ENABLE

MASKABLE INTERRUPTS

SELECT

NORMAL FLAGS

"POP"

THE STACKED PC

IS THERE AN

AN INTERRUPT REQUEST

AND INTERRUPT MASK?

SELECT

INTERRUPT FLAGS

PUSH THE

PC INTO THE STACK

LOAD PC FROM

INTERRUPT VECTOR

DISABLE

MASKABLE INTERRUPT

YES

IS THE CORE

ALREADY IN

NORMAL MODE?

YES

CLEAR

INTERNAL LATCH

If a latch is present on the interrupt source line

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5.11 REGISTER DESCRIPTION

INTERRUPT OPTION REGISTER (IOR)

Address: 0C8h

Write Only

Reset status: 00h

Caution: This register is write-only and cannot be
accessed by single-bit operations (SET, RES,
DEC,...).

Bit 7 =Reserved, must be cleared.

Bit 6 = LES

Level/Edge Selection bit

0: Falling edge sensitive mode is selected for inter-

rupt vector #1

1: Low level sensitive mode is selected for inter-

rupt vector #1

Bit 5 = ESB

Edge Selection bit

0: Falling edge mode on interrupt vector #2
1: Rising edge mode on interrupt vector #2

Bit 4 = GEN

Global Enable Interrupt

0: Disable all maskable interrupts
1: Enable all maskable interrupts

Note: When the GEN bit is cleared, the NMI inter-
rupt is active but cannot be used to exit from STOP
or WAIT modes.

Bits 3:0 = Reserved, must be cleared.

Table 7. Interrupt Mapping

* Depending on device. See device summary on page 1.

LES

ESB

GEN

Vector

number

Source

Block

Description

Register

Label

Flag

Exit

from

STOP

Vector

Address

Priority

Order

RESET

Reset

N/A

yes

FFEh-FFFh

Vector #0

NMI

Non Maskable Interrupt

N/A

yes

FFCh-FFDh

NOT USED

FFAh-FFBh

FF8h-FF9h

Vector #1

Port A

Ext. Interrupt Port A

N/A

yes

FF6h-FF7h

Vector #2

Port B

Ext. Interrupt Port B

N/A

yes

FF4h-FF5h

Vector #3

TIMER

Timer underflow

TSCR

TMZ

yes

FF2h-FF3h

Vector #4

ADC *

End Of Conversion

ADCR

EOC

FF0h-FF1h

Priority

Lowest

Highest

Priority

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6.2 WAIT MODE

The MCU goes into WAIT mode as soon as the
WAIT instruction is executed. This has the follow-
ing effects:

Program execution is stopped, the microcontrol-

ler software can be considered as being in a "fro-
zen" state.

RAM contents and peripheral registers are pre-

served as long as the power supply voltage is
higher than the RAM retention voltage.

The oscillator is kept running to provide a clock

to the peripherals; they are still active.

WAIT mode can be used when the user wants to
reduce the MCU power consumption during idle
periods, while not losing track of time or the ability
to monitor external events. WAIT mode places the
MCU in a low power consumption mode by stop-
ping the CPU. The active oscillator (main oscillator
or LFAO) is kept running in order to provide a clock
signal to the peripherals.

If the power consumption has to be further re-
duced, the Low Frequency Auxiliary Oscillator
(LFAO) can be used in place of the main oscillator,
if its operating frequency is lower. If required, the
LFAO must be switched on before entering WAIT
mode.

Exit from Wait mode

The MCU remains in WAIT mode until one of the
following events occurs:

RESET (Watchdog, LVD or RESET pin)

A peripheral interrupt (timer, ADC,...),

An external interrupt (I/O port, NMI)
The Program Counter then branches to the start-
ing address of the interrupt or RESET service rou-
tine. Refer to

Figure 20

See also

Section 6.4.1

Figure 20. WAIT Mode Flowchart

WAIT INSTRUCTION

RESET

INTERRUPT

Clock to CPU

OSCILLATOR

Clock to PERIPHERALS

Yes

FETCH RESET VECTOR

OR SERVICE INTERRUPT

2048 OR 32768

Clock to CPU

OSCILLATOR

Clock to PERIPHERALS

Restart

Yes

DELAY

CLOCK CYCLE

OSCILLATOR

Clock to PERIPHERALS

Clock to CPU

Yes

ST6200C/ST6201C/ST6203C

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6.3 STOP MODE

STOP mode is the lowest power consumption
mode of the MCU (see

Figure 22

The MCU goes into STOP mode as soon as the
STOP instruction is executed. This has the follow-
ing effects:

Program execution is stopped, the microcontrol-

ler can be considered as being "frozen".

The contents of RAM and the peripheral regis-

ters are kept safely as long as the power supply
voltage is higher than the RAM retention voltage.

The oscillator is stopped, so peripherals cannot

work except the those that can be driven by an
external clock.

Exit from STOP Mode

The MCU remains in STOP mode until one of the
following events occurs:

RESET (Watchdog, LVD or RESET pin)

A peripheral interrupt (assuming this peripheral

can be driven by an external clock)

An external interrupt (I/O port, NMI)

In all cases a delay of 2048 or 32768 clock cycles
(f

INT

) is generated to make sure the oscillator has

started properly.

The Program Counter then points to the starting
address of the interrupt or RESET service routine
(see

Figure 21

STOP Mode and Watchdog

When the Watchdog is active (hardware or soft-
ware activation), the STOP instruction is disabled
and a WAIT instruction will be executed in its place
unless the EXCTNL option bit is set to 1 in the op-
tion bytes and a a high level is present on the NMI
pin. In this case, the STOP instruction will be exe-
cuted and the Watchdog will be frozen.

Figure 21. STOP Mode Timing Overview

STOP

RUN

2048 or 32768

RESET

INTERRUPT

STOP

INSTRUCTION

FETCH

VECTOR

CYCLE

CLOCK

DELAY

ST6200C/ST6201C/ST6203C

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6.4 NOTES RELATED TO WAIT AND STOP MODES

6.4.1 Exit from Wait and Stop Modes

6.4.1.1 NMI Interrupt

It should be noted that when the GEN bit in the
IOR register is low (interrupts disabled), the NMI
interrupt is active but cannot cause a wake up from
STOP/WAIT modes.

6.4.1.2 Restart Sequence

When the MCU exits from WAIT or STOP mode, it
should be noted that the restart sequence de-
pends on the original state of the MCU (normal, in-
terrupt or non-maskable interrupt mode) prior to
entering WAIT or STOP mode, as well as on the
interrupt type.

Normal Mode. If the MCU was in the main routine
when the WAIT or STOP instruction was execut-
ed, exit from Stop or Wait mode will occur as soon
as an interrupt occurs; the related interrupt routine
is executed and, on completion, the instruction
which follows the STOP or WAIT instruction is
then executed, providing no other interrupts are
pending.

Non Maskable Interrupt Mode. If the STOP or
WAIT instruction has been executed during execu-
tion of the non-maskable interrupt routine, the
MCU exits from Stop or Wait mode as soon as an
interrupt occurs: the instruction which follows the
STOP or WAIT instruction is executed, and the
MCU remains in non-maskable interrupt mode,
even if another interrupt has been generated.

Normal Interrupt Mode. If the MCU was in inter-
rupt mode before the STOP or WAIT instruction
was executed, it exits from STOP or WAIT mode

as soon as an interrupt occurs. Nevertheless, two
cases must be considered:

If the interrupt is a normal one, the interrupt rou-

tine in which the WAIT or STOP mode was en-
tered will be completed, starting with the
execution of the instruction which follows the
STOP or the WAIT instruction, and the MCU is
still in interrupt mode. At the end of this routine
pending interrupts will be serviced according to
their priority.

In the event of a non-maskable interrupt, the

non-maskable interrupt service routine is proc-
essed first, then the routine in which the WAIT or
STOP mode was entered will be completed by
executing the instruction following the STOP or
WAIT instruction. The MCU remains in normal in-
terrupt mode.

6.4.2 Recommended MCU Configuration

For lowest power consumption during RUN or
WAIT modes, the user software must configure
the MCU as follows:

Configure unused I/Os as output push-pull low

mode

Place all peripherals in their power down modes

before entering STOP mode

Select the Low Frequency Auxiliary Oscillator

(provided this runs at a lower frequency than the
main oscillator).

The WAIT and STOP instructions are not execut-
ed if an enabled interrupt request is pending.

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7 I/O PORTS

7.1 INTRODUCTION

Each I/O port contains up to 8 pins. Each pin can
be programmed independently as digital input
(with or without pull-up and interrupt generation),
digital output (open drain, push-pull) or analog in-
put (when available).

The I/O pins can be used in either standard or al-
ternate function mode.

Standard I/O mode is used for:

Transfer of data through digital inputs and out-

puts (on specific pins):

External interrupt generation

Alternate function mode is used for:

Alternate signal input/output for the on-chip

peripherals

The generic I/O block diagram is shown in

Figure

7.2 FUNCTIONAL DESCRIPTION

Each port is associated with 3 registers located in
Data space:

Data Register (DR)

Data Direction Register (DDR)

Option Register (OR)

Each I/O pin may be programmed using the corre-
sponding register bits in the DDR, DR and OR reg-
isters: bit x corresponding to pin x of the port.

Table

illustrates the various port configurations which

can be selected by user software.

During MCU initialization, all I/O registers are
cleared and the input mode with pull-up and no in-
terrupt generation is selected for all the pins, thus
avoiding pin conflicts.

7.2.1 Digital Input Modes

The input configuration is selected by clearing the
corresponding DDR register bit.

In this case, reading the DR register returns the
digital value applied to the external I/O pin.

Different input modes can be selected by software
through the DR and OR registers, see

Table 8

External Interrupt Function

All input lines can be individually connected by
software to the interrupt system by programming
the OR and DR registers accordingly. The inter-
rupt trigger modes (falling edge, rising edge and
low level) can be configured by software for each
port as described in the Interrupt section.

7.2.2 Analog Inputs

Some pins can be configured as analog inputs by
programming the OR and DR registers according-
ly, see

Table 8

. These analog inputs are connect-

ed to the on-chip 8-bit Analog to Digital Converter.

Caution: ONLY ONE

pin should be programmed

as an analog input at any time, since by selecting
more than one input simultaneously their pins will
be effectively shorted.

7.2.3 Output Modes

The output configuration is selected by setting the
corresponding DDR register bit. In this case, writ-
ing to the DR register applies this digital value to
the I/O pin through the latch. Then, reading the DR
register returns the previously stored value.

Two different output modes can be selected by
software through the OR register: push-pull and
open-drain.

DR register value and output pin status:

Note: The open drain setting is not a true open
drain. This means it has the same structure as the
push-pull setting but the P-buffer is deactivated.
To avoid damaging the device, please respect the
V

OUT

absolute maximum rating described in the

Electrical Characteristics section.

7.2.4 Alternate Functions

When an on-chip peripheral is configured to use a
pin, the alternate function (timer input/output...) is
not systematically selected but has to be config-
ured through the DDR, OR and DR registers. Re-
fer to the chapter describing the peripheral for
more details.

Push-pull

Open-drain

Floating

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I/O PORTS (Cont'd)

7.2.5 Instructions NOT to be used to access
Port Data registers (SET, RES, INC and DEC)

DO NOT USE READ-MODIFY-WRITE INSTRUC-
TIONS (SET, RES, INC and DEC) ON PORT
DATA REGISTERS IF ANY PIN OF THE PORT IS
CONFIGURED IN INPUT MODE.

These instructions make an implicit read and write
back of the entire register. In port input mode,
however, the data register reads from the input
pins directly, and not from the data register latch-
es. Since data register information in input mode is
used to set the characteristics of the input pin (in-
terrupt, pull-up, analog input), these may be unin-
tentionally reprogrammed depending on the state
of the input pins.

As a general rule, it is better to only use single bit
instructions on data registers when the whole (8-
bit) port is in output mode. In the case of inputs or
of mixed inputs and outputs, it is advisable to keep
a copy of the data register in RAM. Single bit in-
structions may then be used on the RAM copy, af-
ter which the whole copy register can be written to
the port data register:

SET bit, datacopy
LD a, datacopy
LD DRA, a

7.2.6 Recommendations

1. Safe I/O State Switching Sequence

Switching the I/O ports from one state to another
should be done in a sequence which ensures that
no unwanted side effects can occur. The recom-
mended safe transitions are illustrated in

Figure 24

The Interrupt Pull-up to Input Analog transition
(and vice-vesra) is potentially risky and should be
avoided when changing the I/O operating mode.

2. Handling Unused Port Bits

On ports that have less than 8 external pins con-
nected:

Leave the unbonded pins in reset state and do

not change their configuration.

Do not use instructions that act on a whole port

register (INC, DEC, or read operations). Unavail-
able bits must be masked by software (AND in-
struction). Thus, when a read operation
performed on an incomplete port is followed by a
comparison, use a mask.

3. High Impedance Input

On any CMOS device, it is not recommended to
connect high impedance on input pins. The choice
of these impedance has to be done with respect to
the maximum leakage current defined in the da-
tasheet. The risk is to be close or out of specifica-
tion on the input levels applied to the device.

7.3 LOW POWER MODES

The WAIT and STOP instructions allow the
ST62xx to be used in situations where low power
consumption is needed. The lowest power con-
sumption is achieved by configuring I/Os in output
push-pull low mode.

7.4 INTERRUPTS

The external interrupt event generates an interrupt
if the corresponding configuration is selected with
DDR, DR and OR registers (see

Table 8

) and the

GEN-bit in the IOR register is set.

Figure 24. Diagram showing Safe I/O State Transitions

Note *. xxx = DDR, OR, DR Bits respectively

Mode Description

WAIT

No effect on I/O ports. External interrupts
cause the device to exit from WAIT mode.

STOP

No effect on I/O ports. External interrupts
cause the device to exit from STOP mode.

Interrupt
pull-up

Output
Open Drain

Output
Push-pull

Input
pull-up (Reset
state)

Input

Analog

Output

Open Drain

Output

Push-pull

Input

010*

000

100

110

011

001

101

111

ST6200C/ST6201C/ST6203C

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I/O PORTS (Cont'd)

7.5 REGISTER DESCRIPTION

DATA REGISTER (DR)

Port x Data Register
DRx with x = A or B.

Address DRA: 0C0h - Read /Write
Address DRB: 0C1h - Read /Write

Reset Value: 0000 0000 (00h)

Bit 7:0 = D[7:0]

Data register bits.

Reading the DR register returns either the DR reg-
ister latch content (pin configured as output) or the
digital value applied to the I/O pin (pin configured
as input).

Caution: In input mode, modifying this register will
modify the I/O port configuration (see

Table 8

Do not use the Single bit instructions on I/O port
data registers. See (

Section 7.2.5

DATA DIRECTION REGISTER (DDR)

Port x Data Direction Register
DDRx with x = A or B.

Address DDRA: 0C4h - Read /Write
Address DDRB: 0C5h - Read /Write

Reset Value: 0000 0000 (00h)

Bit 7:0 = DD[7:0]

Data direction register bits.

The DDR register gives the input/output direction
configuration of the pins. Each bit is set and
cleared by software.
0: Input mode
1: Output mode

OPTION REGISTER (OR)

Port x Option Register
ORx with x = A or B.

Address ORA: 0CCh - Read/Write
Address ORB: 0CDh - Read/Write
Reset Value: 0000 0000 (00h)

Bit 7:0 = O[7:0]

Option register bits.

The OR register allows to distinguish in output
mode if the push-pull or open drain configuration is
selected.

Output mode:
0: Open drain output(with P-Buffer deactivated)
1: Push-pull Output

Input mode: See

Table 8

Each bit is set and cleared by software.

Caution: Modifying this register, will also modify
the I/O port configuration in input mode. (see

Ta-

ble 8

Table 10. I/O Port Register Map and Reset Values

DD7

DD6

DD5

DD4

DD3

DD2

DD1

DD0

Address

(Hex.)

Register

Label

Reset Value

of all I/O port registers

0C0h

DRA

MSB

LSB

0C1h

DRB

0C4h

DDRA

MSB

LSB

0C5h

DDRB

0CCh

ORA

MSB

LSB

0CDh

ORB

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WATCHDOG TIMER (Cont'd)

8.1.3 Functional Description

The watchdog activation is selected through an
option in the option bytes:

HARDWARE Watchdog option

After reset, the watchdog is permanently active,
the C bit in the WDGR is forced high and the user
can not change it. However, this bit can be read
equally as 0 or 1.

SOFTWARE Watchdog option

After reset, the watchdog is deactivated. The func-
tion is activated by setting C bit in the WDGR reg-
ister. Once activated, it cannot be deactivated.
The counter value stored in the WDGR register
(bits SR:T0), is decremented every 3072 clock cy-
cles. The length of the timeout period can be pro-
grammed by the user in 64 steps of 3072 clock cy-
cles.

If the watchdog is activated (by setting the C bit)
and when the SR bit is cleared,

the watchdog initi-

ates a reset cycle pulling the reset pin low for typi-
cally 500ns.

The application program must write in the WDGR
register at regular intervals during normal opera-
tion to prevent an MCU reset. The value to be
stored in the WDGR register must be between
FEh and 02h (see

Table 11

). To run the watchdog

function the following conditions must be true:

The C bit is set (watchdog activated)

The SR bit is set to prevent generating an imme-

diate reset

The T[5:0] bits contain the number of decre-

ments which represent the time delay before the
watchdog produces a reset.

Table 11. Watchdog Timing (f

OSC

= 8 MHz)

8.1.3.1 Software Reset

The SR bit can be used to generate a software re-
set by clearing the SR bit while the C bit is set.

8.1.4 Recommendations

1. The Watchdog plays an important supporting
role in the high noise immunity of ST62xx devices,
and should be used wherever possible. Watchdog
related options should be selected on the basis of
a trade-off between application security and STOP

mode availability (refer to the description of the
WDACT and EXTCNTL bits on the Option Bytes).

When STOP mode is not required, hardware acti-
vation without EXTERNAL STOP MODE CON-
TROL should be preferred, as it provides maxi-
mum security, especially during power-on.

When STOP mode is required, hardware activa-
tion and EXTERNAL STOP MODE CONTROL
should be chosen. NMI should be high by default,
to allow STOP mode to be entered when the MCU
is idle.

The NMI pin can be connected to an I/O line (see

Figure 26

) to allow its state to be controlled by soft-

ware. The I/O line can then be used to keep NMI
low while Watchdog protection is required, or to
avoid noise or key bounce. When no more
processing is required, the I/O line is released and
the device placed in STOP mode for lowest power
consumption.

Figure 26. A typical circuit making use of the
EXERNAL STOP MODE CONTROL feature

2. When software activation is selected (WDACT
bit in Option byte) and the Watchdog is not activat-
ed, the downcounter may be used as a simple 7-
bit timer (remember that the bits are in reverse or-
der).

The software activation option should be chosen
only when the Watchdog counter is to be used as
a timer. To ensure the Watchdog has not been un-
expectedly activated, the following instructions
should be executed:

jrr 0, WDGR, #+3 ; If C=0,jump to next

ldi WDGR, 0FDH

; SR=0 -> reset

WDGR Register

initial value

WDG timeout period

(ms)

Max.

FEh

24.576

Min.

02h

0.384

NMI

SWITCH

I/O

VR02002

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WATCHDOG TIMER (Cont'd)

These instructions test the C bit and reset the
MCU (i.e. disable the Watchdog) if the bit is set
(i.e. if the Watchdog is active), thus disabling the
Watchdog.

For more information on the use of the watchdog,
please read application note AN1015.

Note: This note applies only when the watchdog is
used as a standard timer. It is recommended to
read the counter twice, as it may sometimes return
an invalid value if the read is performed while the
counter is decremented (counter bits in transient
state). To validate the return value, both values
read must be equal. The counter decrements eve-
ry 384 µs at 8 MHz f

OSC

8.1.5 Low Power Modes

8.1.6 Interrupts

None.

Mode Description

WAIT

No effect on Watchdog.

STOP

Behaviour depends on the EXTCNTL option in the Option bytes:

1. Watchdog disabled:

The MCU will enter Stop mode if a STOP instruction is executed.

2. Watchdog enabled and EXTCNTL option disabled:

If a STOP instruction is encountered, it is interpreted as a WAIT.

3. Watchdog and EXTCNTL option enabled:

If a STOP instruction is encountered when the NMI pin is low, it is interpreted as a WAIT. If, however, the
STOP instruction is encountered when the NMI pin is high, the Watchdog counter is frozen and the CPU en-
ters STOP mode.
When the MCU exits STOP mode (i.e. when an interrupt is generated), the Watchdog resumes its activity.

ST6200C/ST6201C/ST6203C

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WATCHDOG TIMER (Cont'd)

8.1.7 Register Description

WATCHDOG REGISTER (WDGR)

Address: 0D8h - Read /Write

Reset Value: 1111 1110 (FE h)

Bits 7:2 = T[5:0]

Downcounter bits

Caution: These bits are reversed and shifted with
respect to the physical counter: bit-7 (T0) is the
LSB of the Watchdog downcounter and bit-2 (T5)
is the MSB.

Bit 1 = SR:

Software Reset bit

Software can generate a reset by clearing this bit
while the C bit is set. When C = 0 (Watchdog de-
activated) the SR bit is the MSB of the 7-bit timer.
0: Generate (write)

1: No software reset generated, MSB of 7-bit timer

Bit 0 = C

Watchdog Control bit

If the hardware option is selected (WDACT bit in
Option byte), this bit is forced high and cannot be
changed by the user (the Watchdog is always ac-
tive). When the software option is selected
(WDACT bit in Option byte), the Watchdog func-
tion is activated by setting the C bit, and cannot
then be deactivated (except by resetting the
MCU).

When C is kept cleared the counter can be used
as a 7-bit timer.
0: Watchdog deactivated
1: Watchdog activated

ST6200C/ST6201C/ST6203C

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8-BIT TIMER (Cont'd)

8.2.3 Counter/Prescaler Description

Prescaler

The prescaler input is the internal frequency f

INT

divided by 12. The prescaler decrements on the
rising edge, depending on the division factor pro-
grammed by the PS[2:0] bits in the TSCR register.

The state of the 7-bit prescaler can be read in the
PSCR register.

When the prescaler reaches 0, it is automatically
reloaded with 7Fh.

Counter

The free running 8-bit downcounter is fed by the
output of the programmable prescaler, and is dec-
remented on every rising edge of the f

COUNTER

clock signal coming from the prescaler.

It is possible to read or write the contents of the
counter on the fly, by reading or writing the timer
counter register (TCR).

When the downcounter reaches 0, it is automati-
cally reloaded with the value 0FFh.

Counter Clock and Prescaler

The counter clock frequency is given by:

COUNTER

= f

PRESCALER

/ 2

PS[2:0]

where f

PRESCALER

is:

INT

/12

The timer input clock feeds the 7-bit programma-
ble prescaler. The prescaler output can be pro-
grammed by selecting one of the 8 available pres-
caler taps using the PS[2:0] bits in the Status/Con-
trol Register (TSCR). Thus the division factor of
the prescaler can be set to 2

(where n equals 0, to

7). See

Figure 27

The clock input is enabled by the PSI (Prescaler
Initialize) bit in the TSCR register. When PSI is re-
set, the counter is frozen and the prescaler is load-
ed with the value 7Fh. When PSI is set, the pres-
caler and the counter run at the rate of the select-
ed clock source.

Counter and Prescaler Initialization

After RESET, the counter and the prescaler are in-
itialized to 0FFh and 7Fh respectively.

The 7-bit prescaler can be initialized to 7Fh by
clearing the PSI bit. Direct write access to the

prescaler is also possible when PSI =1. Then, any
value between 0 and 7Fh can be loaded into it.

The 8-bit counter can be initialized separately by
writing to the TCR register.

8.2.3.1 8-bit Counting and Interrupt Capability
on Counter Underflow

Whatever the division factor defined for the pres-
caler, the Timer Counter works as an 8-bit down-
counter. The input clock frequency is user selecta-
ble using the PS[2:0] bits.

When the downcounter decrements to zero, the
TMZ (Timer Zero) bit in the TSCR is set. If the ETI
(Enable Timer Interrupt) bit in the TSCR is also
set, an interrupt request is generated.

The Timer interrupt can be used to exit the MCU
from WAIT or STOP mode.

The TCR can be written at any time by software to
define a time period ending with an underflow
event, and therefore manage delay or timer func-
tions.

TMZ is set when the downcounter reaches zero;
however, it may also be set by writing 00h in the
TCR register or by setting bit 7 of the TSCR register.

The TMZ bit must be cleared by user software
when servicing the timer interrupt to avoid unde-
sired interrupts when leaving the interrupt service
routine.

Note: A write to the TCR register will predominate
over the 8-bit counter decrement to 00h function,
i.e. if a write and a TCR register decrement to 00h
occur simultaneously, the write will take prece-
dence, and the TMZ bit is not set until the 8-bit
counter underflows again.

8.2.4 Low Power Modes

8.2.5 Interrupts

Mode Description

WAIT

No effect on timer.
Timer interrupt events cause the device to
exit from WAIT mode.

STOP

Timer registers are frozen.

Interrupt Event

Event

Flag

Enable

Bit

Exit

from

Wait

Exit

from
Stop

Timer Zero
Event

TMZ

ETI

Yes

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8-BIT TIMER (Cont'd)

8.2.6 Register Description

PRESCALER COUNTER REGISTER (PSCR)
Address: 0D2h - Read/Write
Reset Value: 0111 1111 (7Fh)

Bit 7 = PSCR7: Not used, always read as "0".

Bits 6:0 = PSCR[6:0]

Prescaler LSB.

TIMER COUNTER REGISTER (TCR)
Address: 0D3h - Read / Write
Reset Value: 1111 1111 (FFh)

Bits 7:0 = TCR[7:0]

Timer counter bits.

TIMER STATUS CONTROL REGISTER (TSCR)
Address: 0D4h - Read/Write
Reset Value: 0000 0000 (00h)

Bit 7 = TMZ

Timer Zero bit.

A low-to-high transition indicates that the timer
count register has underflowed. It means that the
TCR value has changed from 00h to FFh.
This bit must be cleared by user software.
0: Counter has not underflowed
1: Counter underflow occurred

Bit 6 = ETI

Enable Timer Interrupt.

When set, enables the timer interrupt request. If
ETI=0 the timer interrupt is disabled. If ETI=1 and
TMZ=1 an interrupt request is generated.
0: Interrupt disabled (reset state)
1: Interrupt enabled

Bit 5 = TSCR5 Reserved, must be set.

Bit 4 = TSCR4 Reserved, must be cleared.

Bit 3 = PSI:

Prescaler Initialize bit.

Used to initialize the prescaler and inhibit its count-
ing. When PSI="0" the prescaler is set to 7Fh and
the counter is inhibited. When PSI="1" the prescal-
er is enabled to count downwards. As long as
PSE="1" both counter and prescaler are not run-
ning
0: Counting disabled
1: Counting enabled

Bits 1:0 = PS[2:0]

Prescaler Mux. Select.

These bits select the division ratio of the prescaler
register.

Table 12. Prescaler Division Factors

Table 13. 8-Bit Timer Register Map and Reset Values

PSCR

TCR7

TCR6

TCR5

TCR4

TCR3

TCR2

TCR1

TCR0

TMZ

ETI

TSCR5 TSCR4

PSI

PS2

PS1

PS0

PS2

PS1

PS0

Divided by

128

Address

(Hex.)

Register Label

0D2h

PSCR
Reset Value

PSCR7

PSCR6

PSCR5

PSCR4

PSCR3

PSCR2

PSCR1

PSCR0

0D3h

TCR
Reset Value

TCR7

TCR6

TCR5

TCR4

TCR3

TCR2

TCR1

TCR0

0D4h

TSCR
Reset Value

TMZ

ETI

TSCR5

TSCR4

PSI

PS2

PS1

PS0

ST6200C/ST6201C/ST6203C

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8.3 A/D CONVERTER (ADC)

8.3.1 Introduction

The on-chip Analog to Digital Converter (ADC) pe-
ripheral is a 8-bit, successive approximation con-
verter. This peripheral has multiplexed analog in-
put channels (refer to device pin out description)
that allow the peripheral to convert the analog volt-
age levels from different sources.

The result of the conversion is stored in a 8-bit
Data Register. The A/D converter is controlled
through a Control Register.

8.3.2 Main Features

8-bit conversion

Multiplexed analog input channels

Linear successive approximation

Data register (DR) which contains the results

End of Conversion flag

On/Off bit (to reduce consumption)

Typical conversion time 70 µs (with an 8 MHz
crystal)

The block diagram is shown in

Figure 28

Figure 28. ADC Block Diagram

Note: ADC not present on some devices. See device summary on page 1.

OSC

EAI EOC STA PDS

ADCR

AIN0

AIN1

ANALOG TO DIGITAL

CONVERTER

AINx

PORT

MUX

ADR2 ADR1

ADR3

ADR7 ADR6 ADR5 ADR4

ADR0

ADR

DIV 12

ADC

INT

DDRx

ORx

DRx

I/O PORT

OFF

CR3

CR1

CR0

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A/D CONVERTER (Cont'd)

8.3.3 Functional Description

8.3.3.1 Analog Power Supply

The high and low level reference voltage pins are
internally connected to the V

and V

pins.

Conversion accuracy may therefore be impacted
by voltage drops and noise in the event of heavily
loaded or badly decoupled power supply lines.

8.3.3.2 Digital A/D Conversion Result

The conversion is monotonic, meaning that the re-
sult never decreases if the analog input does not
and never increases if the analog input does not.

If the input voltage (V

AIN

) is greater than or equal

to V

DDA

(high-level voltage reference) then the

conversion result in the DR register is FFh (full
scale) without overflow indication.

If input voltage (V

AIN

) is lower than or equal to

SSA

(low-level voltage reference) then the con-

version result in the DR register is 00h.

The A/D converter is linear and the digital result of
the conversion is stored in the ADR register. The
accuracy of the conversion is described in the par-
ametric section.

AIN

is the maximum recommended impedance

for an analog input signal. If the impedance is too
high, this will result in a loss of accuracy due to
leakage and sampling not being completed in the
allocated time. Refer to the electrical characteris-
tics chapter for more details.

With an oscillator clock frequency less than
1.2MHz, conversion accuracy is decreased.

8.3.3.3 Analog Input Selection

Selection of the input pin is done by configuring
the related I/O line as an analog input via the Data
Direction, Option and Data registers (refer to I/O
ports description for additional information).

Caution: Only one I/O line must be configured as
an analog input at any time. The user must avoid
any situation in which more than one I/O pin is se-
lected as an analog input simultaneously, because
they will be shorted internally.

8.3.3.4 Software Procedure

Refer to the Control register (ADCR) and Data reg-
ister (ADR) in

Section 8.3.7

for the bit definitions.

Analog Input Configuration

The analog input must be configured through the
Port Control registers (DDRx, ORx and DRx). Re-
fer to the I/O port chapter.

ADC Configuration

In the ADCR register:

Reset the PDS bit to power on the ADC. This bit

must be set at least one instruction before the
beginning of the conversion to allow stabilisation
of the A/D converter.

Set the EAI bit to enable the ADC interrupt if

needed.

ADC Conversion

In the ADCR register:

Set the STA bit to start a conversion. This auto-

matically clears (resets to "0") the End Of Con-
version Bit (EOC).

When a conversion is complete

The EOC bit is set by hardware to flag that con-

version is complete and that the data in the ADC
data conversion register is valid.

An interrupt is generated if the EAI bit was set

Setting the STA bit will start a new count and will
clear the EOC bit (thus clearing the interrupt con-
dition)

Note:

Setting the STA bit must be done by a different in-
struction from the instruction that powers-on the
ADC (setting the PDS bit) in order to make sure
the voltage to be converted is present on the pin.

Each conversion has to be separately initiated by
writing to the STA bit.

The STA bit is continuously scanned so that, if the
user sets it to "1" while a previous conversion is in
progress, a new conversion is started before com-
pleting the previous one. The start bit (STA) is a
write only bit, any attempt to read it will show a log-
ical "0".

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A/D CONVERTER (Cont'd)

8.3.4 Recommendations

The following six notes provide additional informa-
tion on using the A/D converter.

1.The A/D converter does not feature a sample
and hold circuit. The analog voltage to be meas-
ured should therefore be stable during the entire
conversion cycle. Voltage variation should not ex-
ceed ±1/2 LSB for optimum conversion accuracy.
A low pass filter may be used at the analog input
pins to reduce input voltage variation during con-
version.

2. When selected as an analog channel, the input
pin is internally connected to a capacitor C

typically 9pF. For maximum accuracy, this capaci-
tor must be fully charged at the beginning of con-
version. In the worst case, conversion starts one
instruction (6.5 µs) after the channel has been se-
lected. The impedance of the analog voltage
source (ASI) in worst case conditions, is calculat-
ed using the following formula:

6.5µs = 9 x C

x ASI

(capacitor charged to over 99.9%), i.e. 30 k

in-

cluding a 50% guardband.
The ASI can be higher if C

has been charged for

a longer period by adding instructions before the
start of conversion (adding more than 26 CPU cy-
cles is pointless).

3. Since the ADC is on the same chip as the micro-
processor, the user should not switch heavily load-
ed output signals during conversion, if high preci-
sion is required. Such switching will affect the sup-
ply voltages used as analog references.

4. Conversion accuracy depends on the quality of
the power supplies (V

and V

). The user must

take special care to ensure a well regulated refer-
ence voltage is present on the V

and V

pins

(power supply voltage variations must be less than
0.1V/ms). This implies, in particular, that a suitable
decoupling capacitor is used at the V

pin.

The converter resolution is given by:

The Input voltage (Ain) which is to be converted
must be constant for 1µs before conversion and
remain constant during conversion.

5. Conversion resolution can be improved if the
power supply voltage (V

) to the microcontroller

is lowered.

6. In order to optimize the conversion resolution,
the user can configure the microcontroller in WAIT
mode, because this mode minimises noise distur-

bances and power supply variations due to output
switching. Nevertheless, the WAIT instruction
should be executed as soon as possible after the
beginning of the conversion, because execution of
the WAIT instruction may cause a small variation
of the V

voltage. The negative effect of this var-

iation is minimized at the beginning of the conver-
sion when the converter is less sensitive, rather
than at the end of conversion, when the least sig-
nificant bits are determined.
The best configuration, from an accuracy stand-
point, is WAIT mode with the Timer stopped. In
this case only the ADC peripheral and the oscilla-
tor are then still working. The MCU must be woken
up from WAIT mode by the ADC interrupt at the
end of the conversion. The microcontroller can
also be woken up by the Timer interrupt, but this
means the Timer must be running and the result-
ing noise could affect conversion accuracy.

Caution: When an I/O pin is used as an analog in-
put, A/D conversion accuracy will be impaired if
negative current injections (V

INJ

< V

) occur from

adjacent I/O pins with analog input capability. Re-
fer to

Figure 29

. To avoid this:

Use another I/O port located further away from

the analog pin, preferably not multiplexed on the
A/D converter

Increase the input resistance R

IN J

(to reduce the

current injections) and reduce R

ADC

(to preserve

conversion accuracy).

Figure 29. Leakage from Digital Inputs

256

--------------------------------

PBy/AINy

PBx/AINx

ADC

Leakage Current
if V

INJ

< V

A/D

I/O Port
(Digital I/O)

INJ

Converter

Digital
Input

Analog
Input

AIN

INJ

ST6200C/ST6201C/ST6203C

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A/D CONVERTER (Cont'd)

8.3.5 Low Power Modes

Note: The A/D converter may be disabled by clear-
ing the PDS bit. This feature allows reduced power
consumption when no conversion is needed.

8.3.6 Interrupts

Note: The EOC bit is cleared only when a new
conversion is started (it cannot be cleared by writ-
ing 0). To avoid generating further EOC interrupt,
the EAI bit has to be cleared within the ADC inter-
rupt subroutine.

8.3.7 Register Description

A/D CONVERTER CONTROL REGISTER (AD-
CR)

Address: 0D1h - Read/Write (Bit 6 Read Only, Bit
5 Write Only)

Reset value: 0100 0000 (40h)

Bit 7 = EAI

Enable A/D Interrupt.

0: ADC interrupt disabled
1: ADC interrupt enabled

Bit 6 = EOC

End of conversion.

Read Only

When a conversion has been completed, this bit is
set by hardware and an interrupt request is gener-
ated if the EAI bit is set. The EOC bit is automati-

cally cleared when the STA bit is set. Data in the
data conversion register are valid only when this
bit is set to "1".
0: Conversion is not complete
1: Conversion can be read from the ADR register

Bit 5 = STA

: Start of Conversion. Write Only

0: No effect
1: Start conversion

Note: Setting this bit automatically clears the EOC
bit. If the bit is set again when a conversion is in
progress, the present conversion is stopped and a
new one will take place. This bit is write only, any
attempt to read it will show a logical zero.

Bit 4 = PDS

Power Down Selection.

0: A/D converter is switched off
1: A/D converter is switched on

Bit 3 = ADCR3 Reserved, must be cleared.

Bit 2 = OSCOFF

Main Oscillator off.

0: Main Oscillator enabled
1: Main Oscillator disabled

Note: This bit does not apply to the ADC peripher-
al but to the main clock system. Refer to the Clock
System section.

Bits 1:0 = ADCR[1:0] Reserved, must be cleared.

A/D CONVERTER DATA REGISTER (ADR)

Address: 0D0h - Read only

Reset value: xxxx xxxx (xxh)

Bits 7:0 = ADR[7:0]

: 8 Bit A/D Conversion Result.

Table 14. ADC Register Map and Reset Values

Mode Description

WAIT

No effect on A/D Converter. ADC interrupts
cause the device to exit from Wait mode.

STOP

A/D Converter disabled.

Interrupt Event

Event

Flag

Enable

Bit

Exit

from

Wait

Exit

from
Stop

End of Conver-
sion

EOC

EAI

Yes

EAI

EOC

STA

PDS

ADCR

OSC

OFF

ADCR

ADR7

ADR6

ADR5

ADR4

ADR3

ADR2

ADR1

ADR0

Address

(Hex.)

Register

Label

0D0h

ADR
Reset Value

ADR7

ADR6

ADR5

ADR4

ADR3

ADR2

ADR1

ADR0

0D1h

ADCR
Reset Value

EAI

EOC

STA

PDS

ADCR3

OSCOFF

ADCR1

ADCR0

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9 INSTRUCTION SET

9.1 ST6 ARCHITECTURE

The ST6 architecture has been designed for max-
imum efficiency while keeping byte usage to a
minimum; in short, to provide byte-efficient pro-
gramming. The ST6 core has the ability to set or
clear any register or RAM location bit in Data
space using a single instruction. Furthermore, pro-
grams can branch to a selected address depend-
ing on the status of any bit in Data space.

9.2 ADDRESSING MODES

The ST6 has nine addressing modes, which are
described in the following paragraphs. Three dif-
ferent address spaces are available: Program
space, Data space, and Stack space. Program
space contains the instructions which are to be ex-
ecuted, plus the data for immediate mode instruc-
tions. Data space contains the Accumulator, the X,
Y, V and W registers, peripheral and Input/Output
registers, the RAM locations and Data ROM loca-
tions (for storage of tables and constants). Stack
space contains six 12-bit RAM cells used to stack
the return addresses for subroutines and inter-
rupts.

Immediate. In immediate addressing mode, the
operand of the instruction follows the opcode loca-
tion. As the operand is a ROM byte, the immediate
addressing mode is used to access constants
which do not change during program execution
(e.g., a constant used to initialize a loop counter).

Direct. In direct addressing mode, the address of
the byte which is processed by the instruction is
stored in the location which follows the opcode. Di-
rect addressing allows the user to directly address
the 256 bytes in Data Space memory with a single
two-byte instruction.

Short Direct. The core can address the four RAM
registers X, Y, V, W (locations 80h, 81h, 82h, 83h)
in short-direct addressing mode. In this case, the
instruction is only one byte and the selection of the
location to be processed is contained in the op-
code. Short direct addressing is a subset of direct
addressing mode. (Note that 80h and 81h are also
indirect registers).

Extended. In extended addressing mode, the 12-
bit address needed to define the instruction is ob-
tained by concatenating the four least significant
bits of the opcode with the byte following the op-
code. The instructions (JP, CALL) which use ex-

tended addressing mode are able to branch to any
address in the 4 Kbyte Program space.

Extended addressing mode instructions are two
bytes long.

Program Counter Relative. Relative addressing
mode is only used in conditional branch instruc-
tions. The instruction is used to perform a test and,
if the condition is true, a branch with a span of -15
to +16 locations next to the address of the relative
instruction. If the condition is not true, the instruc-
tion which follows the relative instruction is execut-
ed. Relative addressing mode instructions are one
byte long. The opcode is obtained by adding the
three most significant bits which characterize the
test condition, one bit which determines whether it
is a forward branch (when it is 0) or backward
branch (when it is 1) and the four least significant
bits which give the span of the branch (0h to Fh)
which must be added or subtracted from the ad-
dress of the relative instruction to obtain the
branch destination address.

Bit Direct. In bit direct addressing mode, the bit to
be set or cleared is part of the opcode, and the
byte following the opcode points to the address of
the byte in which the specified bit must be set or
cleared. Thus, any bit in the 256 locations of Data
space memory can be set or cleared.

Bit Test & Branch. Bit test and branch addressing
mode is a combination of direct addressing and
relative addressing. Bit test and branch instruc-
tions are three bytes long. The bit identification
and the test condition are included in the opcode
byte. The address of the byte to be tested is given
in the next byte. The third byte is the jump dis-
placement, which is in the range of -127 to +128.
This displacement can be determined using a la-
bel, which is converted by the assembler.

Indirect. In indirect addressing mode, the byte
processed by the register-indirect instruction is at
the address pointed to by the content of one of the
indirect registers, X or Y (80h, 81h). The indirect
register is selected by bit 4 of the opcode. Register
indirect instructions are one byte long.

Inherent. In inherent addressing mode, all the in-
formation necessary for executing the instruction
is contained in the opcode. These instructions are
one byte long.

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9.3 INSTRUCTION SET

The ST6 offers a set of 40 basic instructions
which, when combined with nine addressing
modes, yield 244 usable opcodes. They can be di-
vided into six different types: load/store, arithme-
tic/logic, conditional branch, control instructions,
jump/call, and bit manipulation. The following par-
agraphs describe the different types.

All the instructions belonging to a given type are
presented in individual tables.

Load & Store. These instructions use one, two or
three bytes depending on the addressing mode.
For LOAD, one operand is the Accumulator and
the other operand is obtained from data memory
using one of the addressing modes.

For Load Immediate, one operand can be any of
the 256 data space bytes while the other is always
immediate data.

Table 15. Load & Store Instructions

Legend:
X, Y

Index Registers,

V, W Short Direct Registers
#

Immediate data (stored in ROM memory)

Data space register

Affected

Not Affected

Instruction

Addressing Mode

Bytes

Cycles

Flags

LD A, X

Short Direct

LD A, Y

Short Direct

LD A, V

Short Direct

LD A, W

Short Direct

LD X, A

Short Direct

LD Y, A

Short Direct

LD V, A

Short Direct

LD W, A

Short Direct

LD A, rr

Direct

LD rr, A

Direct

LD A, (X)

Indirect

LD A, (Y)

Indirect

LD (X), A

Indirect

LD (Y), A

Indirect

LDI A, #N

Immediate

LDI rr, #N

Immediate

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INSTRUCTION SET (Cont'd)

Arithmetic and Logic. These instructions are
used to perform arithmetic calculations and logic
operations. In AND, ADD, CP, SUB instructions
one operand is always the accumulator while, de-
pending on the addressing mode, the other can be

either a data space memory location or an imme-
diate value. In CLR, DEC, INC instructions the op-
erand can be any of the 256 data space address-
es. In COM, RLC, SLA the operand is always the
accumulator.

Table 16. Arithmetic & Logic Instructions

Notes:
X,Y

Index Registers

V, W Short Direct Registers

Affected

# Immediate data (stored in ROM memory)
* Not Affected
rr Data space register

Instruction

Addressing Mode

Bytes

Cycles

Flags

ADD A, (X)

Indirect

ADD A, (Y)

Indirect

ADD A, rr

Direct

ADDI A, #N

Immediate

AND A, (X)

Indirect

AND A, (Y)

Indirect

AND A, rr

Direct

ANDI A, #N

Immediate

CLR A

Short Direct

CLR r

Direct

COM A

Inherent

CP A, (X)

Indirect

CP A, (Y)

Indirect

CP A, rr

Direct

CPI A, #N

Immediate

DEC X

Short Direct

DEC Y

Short Direct

DEC V

Short Direct

DEC W

Short Direct

DEC A

Direct

DEC rr

Direct

DEC (X)

Indirect

DEC (Y)

Indirect

INC X

Short Direct

INC Y

Short Direct

INC V

Short Direct

INC W

Short Direct

INC A

Direct

INC rr

Direct

INC (X)

Indirect

INC (Y)

Indirect

RLC A

Inherent

SLA A

Inherent

SUB A, (X)

Indirect

SUB A, (Y)

Indirect

SUB A, rr

Direct

SUBI A, #N

Immediate

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INSTRUCTION SET (Cont'd)

Conditional Branch. Branch instructions perform
a branch in the program when the selected condi-
tion is met.

Bit Manipulation Instructions. These instruc-
tions can handle any bit in Data space memory.
One group either sets or clears. The other group
(see Conditional Branch) performs the bit test
branch operations.

Control Instructions. Control instructions control
microcontroller operations during program execu-
tion.

Jump and Call. These two instructions are used
to perform long (12-bit) jumps or subroutine calls
to any location in the whole program space.

Table 17. Conditional Branch Instructions

Notes

3-bit address

Data space register

5 bit signed displacement in the range -15 to +16

Affected. The tested bit is shifted into carry.

8 bit signed displacement in the range -126 to +129

Not Affected

Table 18. Bit Manipulation Instructions

Notes:
b

3-bit address

Not Affected

Data space register

Bit Manipulation Instructions should not be used on Port Data Registers and any registers with read only and/or write only bits (see I/O port
chapter)

Table 19. Control Instructions

Notes:
1.

This instruction is deactivated and a WAIT is automatically executed instead of a STOP if the watchdog function is selected.

Affected

*Not Affected

Table 20. Jump & Call Instructions

Notes:
abc 12-bit address
*

Not Affected

Instruction

Branch If

Bytes

Cycles

Flags

JRC e

C = 1

JRNC e

C = 0

JRZ e

Z = 1

JRNZ e

Z = 0

JRR b, rr, ee

Bit = 0

JRS b, rr, ee

Bit = 1

Instruction

Addressing Mode

Bytes

Cycles

Flags

SET b,rr

Bit Direct

RES b,rr

Bit Direct

Instruction

Addressing Mode

Bytes

Cycles

Flags

NOP

Inherent

RET

Inherent

RETI

Inherent

STOP

(1)

Inherent

WAIT

Inherent

Instruction

Addressing Mode

Bytes

Cycles

Flags

CALL abc

Extended

JP abc

Extended

ST6200C/ST6201C/ST6203C

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Opcode Map Summary. The following table contains an opcode map for the instructions used by the ST6

LOW

0000

0001

0010

0011

0100

0101

0110

0111

LOW

0000

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

0000

abc

b0,rr,ee

e NOP

a,(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

0001

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

INC 2

JRC 4

LDI

0001

abc

b0,rr,ee

a,nn

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc 2

imm

0010

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

0010

abc

b4,rr,ee

a,(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

0011

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

LD 2

JRC 4

CPI

0011

abc

b4,rr,ee

a,x

a,nn

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc 2

imm

0100

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

ADD

0100

abc

b2,rr,ee

a,(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

0101

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

INC 2

JRC 4

ADDI

0101

abc

b2,rr,ee

a,nn

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc 2

imm

0110

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

INC

0110

abc

b6,rr,ee

(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

0111

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

LD 2

JRC

0111

abc

b6,rr,ee

a,y

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc

1000

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

1000

abc

b1,rr,ee

(x),a

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

1001

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

INC 2

JRC

1001

abc

b1,rr,ee

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc

1010

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

AND

1010

abc

b5,rr,ee

a,(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

1011

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

LD 2

JRC 4

ANDI

1011

abc

b5,rr,ee

a,v

a,nn

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc 2

imm

1100

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

SUB

1100

abc

b3,rr,ee

a,(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

1101

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

INC 2

JRC 4

SUBI

1101

abc

b3,rr,ee

a,nn

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc 2

imm

1110

JRNZ 4

CALL 2

JRNC 5

JRR 2

JRZ

JRC 4

DEC

1110

abc

b7,rr,ee

(x)

pcr 2

ext 1

pcr 3

bt 1

pcr

prc 1

ind

1111

JRNZ 4

CALL 2

JRNC 5

JRS 2

JRZ 4

LD 2

JRC

1111

abc

b7,rr,ee

a,w

pcr 2

ext 1

pcr 3

bt 1

pcr 1

sd 1

prc

Abbreviations for Addressing Modes: Legend:
dir

Direct

Indicates Illegal Instructions

Short Direct

5-bit Displacement

imm

Immediate

3-bit Address

inh

Inherent

1-byte Data space address

ext

Extended

1-byte immediate data

b.d

Bit Direct

abc

12-bit address

Bit

Test ee

8-bit

displacement

pcr

Program Counter Relative

ind Indirect

JRC

prc

Mnemonic

Addressing Mode

Bytes

Cycles

Operands

ST6200C/ST6201C/ST6203C

57/100

Opcode Map Summary (Continued)

LOW

1000

1001

1010

1011

1100

1101

1110

1111

LOW

0000

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 4

LDI 2

JRC 4

0000

abc

b0,rr

rr,nn

a,(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr 3

imm 1

prc 1

ind

0001

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

DEC 2

JRC 4

0001

abc

b0,rr

a,rr

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

0010

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 4

COM 2

JRC 4

0010

abc

b4,rr

a,(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr

prc 1

ind

0011

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

LD 2

JRC 4

0011

abc

b4,rr

x,a

a,rr

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

0100

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 2

RETI 2

JRC 4

ADD

0100

abc

b2,rr

a,(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

inh 1

prc 1

ind

0101

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

DEC 2

JRC 4

ADD

0101

abc

b2,rr

a,rr

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

0110

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 2

STOP 2

JRC 4

INC

0110

abc

b6,rr

(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

inh 1

prc 1

ind

0111

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

LD 2

JRC 4

INC

0111

abc

b6,rr

y,a

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

1000

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ

JRC 4

1000

abc

b1,rr

(y),a

pcr 2

ext 1

pcr 2

b.d 1

pcr

prc 1

ind

1001

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

DEC 2

JRC 4

1001

abc

b1,rr

rr,a

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

1010

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 4

RCL 2

JRC 4

AND

1010

abc

b5,rr

a,(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

inh 1

prc 1

ind

1011

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

LD 2

JRC 4

AND

1011

abc

b5,rr

v,a

a,rr

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

1100

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 2

RET 2

JRC 4

SUB

1100

abc

b3,rr

a,(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

inh 1

prc 1

ind

1101

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

DEC 2

JRC 4

SUB

1101

abc

b3,rr

a,rr

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

1110

JRNZ 4

JP 2

JRNC 4

RES 2

JRZ 2

WAIT 2

JRC 4

DEC

1110

abc

b7,rr

(y)

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

inh 1

prc 1

ind

1111

JRNZ 4

JP 2

JRNC 4

SET 2

JRZ 4

LD 2

JRC 4

DEC

1111

abc

b7,rr

w,a

pcr 2

ext 1

pcr 2

b.d 1

pcr 1

sd 1

prc 2

dir

Abbreviations for Addressing Modes: Legend:
dir

Direct

Indicates Illegal Instructions

Short Direct

5-bit Displacement

imm

Immediate

3-bit Address

inh

Inherent

1-byte Data space address

ext

Extended

1-byte immediate data

b.d

Bit Direct

abc

12-bit address

Bit

Test ee

8-bit

Displacement

pcr

Program Counter Relative

ind Indirect

JRC

prc

Mnemonic

Addressing Mode

Bytes

Cycles

Operands

ST6200C/ST6201C/ST6203C

58/100

10 ELECTRICAL CHARACTERISTICS

10.1 PARAMETER CONDITIONS

Unless otherwise specified, all voltages are re-
ferred to V

10.1.1 Minimum and Maximum Values

Unless otherwise specified the minimum and max-
imum values are guaranteed in the worst condi-
tions of ambient temperature, supply voltage and
frequencies by tests in production on 100% of the
devices with an ambient temperature at T

=25°C

and T

max (given by the selected temperature

range).

Data based on characterization results, design
simulation and/or technology characteristics are
indicated in the table footnotes and are not tested
in production. Based on characterization, the min-
imum and maximum values refer to sample tests
and represent the mean value plus or minus three
times the standard deviation (mean±3

10.1.2 Typical Values

Unless otherwise specified, typical data are based
on T

=25°C, V

=5V (for the 4.5V

6.0V

voltage range) and V

=3.3V (for the

3.6V voltage range). They are given only

as design guidelines and are not tested.

10.1.3 Typical Curves

Unless otherwise specified, all typical curves are
given only as design guidelines and are not tested.

10.1.4 Loading Capacitor

The loading conditions used for pin parameter
measurement is shown in

Figure 30

Figure 30. Pin Loading Conditions

10.1.5 Pin Input Voltage

The input voltage measurement on a pin of the de-
vice is described in

Figure 31

Figure 31. Pin Input Voltage

ST6 PIN

ST6200C/ST6201C/ST6203C

59/100

10.2 ABSOLUTE MAXIMUM RATINGS

Stresses above those listed as "absolute maxi-
mum ratings" may cause permanent damage to
the device. This is a stress rating only and func-
tional operation of the device under these condi-

tions is not implied. Exposure to maximum rating
conditions for extended periods may affect device
reliability.

10.2.1 Voltage Characteristics

10.2.2 Current Characteristics

10.2.3 Thermal Characteristics

Notes:
1. Directly connecting the RESET and I/O pins to V

or V

could damage the device if an unintentional internal reset

is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program coun-
ter). To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7k

for RESET, 10k

for I/Os). Unused I/O pins must be tied in the same way to V

or V

according to their reset con-

figuration.

2. When the current limitation is not possible, the V

absolute maximum rating must be respected, otherwise refer to

INJ(PIN)

specification. A positive injection is induced by V

while a negative injection is induced by V

3. Power (V

) and ground (V

) lines must always be connected to the external supply.

4. Negative injection disturbs the analog performance of the device. In particular, it induces leakage currents throughout

the device including the analog inputs. To avoid undesirable effects on the analog functions, care must be taken:
- Analog input pins must have a negative injection less than 1mA (assuming that the impedance of the analog voltage
is lower than the specified limits).
- Pure digital pins must have a negative injection less than 1mA. In addition, it is recommended to inject the current as
far as possible from the analog input pins.

Symbol

Ratings

Maximum value

Unit

- V

Supply voltage

Input voltage on any pin

1) & 2)

-0.3 to V

+0.3

OUT

Output voltage on any pin

1) & 2)

-0.3 to V

+0.3

ESD(HBM)

Electro-static discharge voltage (Human Body Model)

3500

Symbol

Ratings

Maximum value

Unit

VDD

Total current into V

power lines (source)

VSS

Total current out of V

ground lines (sink)

100

Output current sunk by any standard I/O and control pin

Output current sunk by any high sink I/O pin

Output current source by any I/Os and control pin

INJ(PIN)

2) & 4)

Injected current on RESET pin

Injected current on any other pin

Symbol

Ratings

Value

Unit

STG

Storage temperature range

-60 to +150

°C

Maximum junction temperature
(

see THERMAL CHARACTERISTICS section

)

ST6200C/ST6201C/ST6203C

60/100

10.3 OPERATING CONDITIONS

10.3.1 General Operating Conditions

Notes:
1. An oscillator frequency above 1.2MHz is recommended for reliable A/D results.
2. Operating conditions with T

=-40 to +125°C.

Figure 32. f

OSC

Maximum Operating Frequency Versus V

Supply Voltage for OTP & ROM devices

Symbol

Parameter

Conditions

Min

Max

Unit

Supply voltage

see

Figure 32

3.0

OSC

Oscillator frequency

=3.0V, 1 & 6 Suffix

MHz

=3.0V, 3 Suffix

=3.6V, 1 & 6Suffix

=3.6V, 3 Suffix

Operating Supply Voltage

OSC

=4MHz, 1 & 6 Suffix

3.0

6.0

OSC

=4MHz, 3 Suffix

3.0

6.0

OSC

=8MHz, 1 & 6 Suffix

3.6

6.0

OSC

=8MHz, 3 Suffix

4.5

6.0

Ambient temperature range

1 Suffix Version

°C

6 Suffix Version

-40

3 Suffix Version

-40

125

2.5

3.6

4.5

5.5

SUPPLY

OSG

Min

OSC

[MHz]

I
T

I
S

VOLTAGE (V

)

1. In this area, operation is guaranteed at the quartz crystal frequency.
2. When the OSG is disabled, operation in this area is guaranteed at the crystal frequency. When the

3. When the OSG is disabled, operation in this area is guaranteed at the quartz crystal frequency. When

OSG is enabled, operation in this area is guaranteed at a frequency of at least f

OSG

Min.

the OSG is enabled, access to this area is prevented. The internal frequency is kept at f

OSG

1 & 6 suffix version

3 suffix version

ST6200C/ST6201C/ST6203C

61/100

OPERATING CONDITIONS (Cont'd)

10.3.2 Operating Conditions with Low Voltage Detector (LVD)

Subject to general operating conditions for V

, f

OSC

, and T

Notes:
1. LVD typical data are based on T

=25°C. They are given only as design guidelines and are not tested.

2. The minimum V

rise time rate is needed to insure a correct device power-on and LVD reset. Not tested in production.

3. Data based on characterization results, not tested in production.

Figure 33. LVD Threshold Versus V

and f

OSC

Figure 34. Typical LVD Thresholds Versus
Temperature for OTP devices

Figure 35. Typical LVD thresholds vs.
Temperature for ROM devices

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

IT+

Reset release threshold
(V

rise)

3.9

4.1

4.3

IT-

Reset generation threshold
(V

fall)

3.6

3.8

hys

LVD voltage threshold hysteresis

IT+

-V

IT-

300

700

POR

rise time rate

mV/s

g(VDD)

Filtered glitch delay on V

Not detected by the LVD

OSC

[MHz]

SUPPLY

2.5

3.5

4.5

5.5

FUNCTIONAL AREA

RESET

FUNCTIONALITY
NOT GUARANTEED
IN THIS AREA

IT-

3.6

DEVICE UNDER

IN THIS AREA

VOLTAGE [V]

-40°C

25°C

95°C

125°C

T [°C]

3.6

3.8

4.2

Thresholds [V]

Vdd up

Vdd down

IT+

IT-

-40°C

25°C

95°C

125°C

T [°C]

3.6

3.8

4.2

Thresholds [V]

Vdd up

Vdd down

IT+

IT-

ST6200C/ST6201C/ST6203C

62/100

10.4 SUPPLY CURRENT CHARACTERISTICS

The following current consumption specified for
the ST6 functional operating modes over tempera-
ture range does not take into account the clock
source current consumption. To get the total de-

vice consumption, the two current values must be
added (except for STOP mode for which the clock
is stopped).

10.4.1 RUN Modes

Notes:
1. Typical data are based on T

=25°C, V

=5V (4.5V

6.0V range) and V

=3.3V (3V

3.6V range).

2. Data based on characterization results, tested in production at V

max. and f

OSC

max.

3. CPU running with memory access, all I/O pins in input with pull-up mode (no load), all peripherals in reset state; clock

input (OSC

) driven by external square wave, OSG and LVD disabled, option bytes not programmed.

Figure 36. Typical I

in RUN vs. f

CPU

Figure 37. Typical I

in RUN vs. Temperature

= 5V)

Symbol

Parameter

Conditions

Typ

Max

Unit

Supply current in RUN mode

(see

Figure 36

Figure 37

)

4.5

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

0.5
1.3
1.6
2.2
3.3

0.7
1.7
2.4
3.3
4.8

Supply current in RUN mode

(see

Figure 36

Figure 37

)

3.6V

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

0.3
0.6
0.9
1.0
1.8

0.4
0.8
1.2
1.5
2.3

VDD [V]

IDD [mA]

8MHz

4MHz

2MHz

1MHz

32KHz

-40

125

T[°C]

0.5

1.5

2.5

3.5

IDD [mA]

8MHz

4MHz

2MHz

1MHz

32KHz

ST6200C/ST6201C/ST6203C

63/100

SUPPLY CURRENT CHARACTERISTICS (Cont'd)

10.4.2 WAIT Modes

Notes:
1. Typical data are based on T

=25°C, V

=5V (4.5V

6.0V range) and V

=3.3V (3V

3.6V range).

2. Data based on characterization results, tested in production at V

max. and f

OSC

max.

3. All I/O pins in input with pull-up mode (no load), all peripherals in reset state; clock input (OSC

) driven by external

square wave, OSG and LVD disabled.

Symbol

Parameter

Conditions

Typ

Max

Unit

Supply current in WAIT mode

Option bytes not programmed
(see

Figure 38

)

4.5V

6.0V

OTP

devic

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

330
350
370
410
480

550
600
650
700
800

µA

Supply current in WAIT mode

Option bytes programmed to 00H
(see

Figure 39

)

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

18
26
41
57
70

60
80

120
180
200

Supply current in WAIT mode

(see

Figure 40

)

M dev

ices

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

190
210
240
280
350

300
350
400
500
600

Supply current in WAIT mode

Option bytes not programmed
(see

Figure 38

)

TP de

vices

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

80
90

100
120
150

120
140
150
200
250

Supply current in WAIT mode

Option bytes programmed to 00H
(see

Figure 39

)

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

5
8

16
18
20

30
40
50
60

100

Supply current in WAIT mode

Option bytes not programmed
(see

Figure 40

)

OM device

OSC

=32kHz

OSC

=1MHz

OSC

=2MHz

OSC

=4MHz

OSC

=8MHz

60
65
80

100
130

100
110
120
150
210

ST6200C/ST6201C/ST6203C

67/100

SUPPLY CURRENT CHARACTERISTICS (Cont'd)

10.4.4 Supply and Clock System

The previous current consumption specified for
the ST6 functional operating modes over tempera-
ture range does not take into account the clock

source current consumption. To get the total de-
vice consumption, the two current values must be
added (except for STOP mode).

10.4.5 On-Chip Peripherals

Notes:
1. Typical data are based on T

=25°C.

2. Data based on characterization results, not tested in production.
3. Data based on a differential I

measurement between reset configuration (OSG and LFAO disabled) and LFAO run-

ning (also includes the OSG stand alone consumption).

4. Data based on a differential I

measurement between reset configuration with OSG disabled and OSG enabled.

5. Data based on a differential I

measurement between reset configuration with LVD disabled and LVD enabled.

6. Data based on a differential I

measurement between reset configuration (timer disabled) and timer running.

7. Data based on a differential I

measurement between reset configuration and continuous A/D conversions.

Symbol

Parameter

Conditions

Typ

Max

Unit

DD(CK)

Supply current of RC oscillator

OSC

=32 kHz,

OSC

=1 MHz

OSC

=2 MHz

OSC

=4 MHz

OSC

=8 MHz

5.0 V

230
260
340
480

OSC

=32 kHz,

OSC

=1 MHz

OSC

=2 MHz

OSC

=4 MHz

OSC

=8 MHz

3.3 V

110
180
320

Supply current of resonator oscillator

OSC

=32 kHz,

OSC

=1 MHz

OSC

=2 MHz

OSC

=4 MHz

OSC

=8MHz

5.0 V

900
280
240
140

OSC

=32 kHz,

OSC

=1 MHz

OSC

=2 MHz

OSC

=4 MHz

OSC

=8 MHz

3.3 V

120

70
50
20
10

DD(LFAO)

LFAO supply current

5.0 V

102

DD(OSG)

OSG supply current

5.0 V

DD(LVD)

LVD supply current

5.0 V

170

Symbol

Parameter

Conditions

Typ

Unit

DD(TIM)

8-bit Timer supply current

OSC

=8 MHz

5.0 V

170

µA

3.3 V

100

DD(ADC)

ADC supply current when converting

OSC

=8 MHz

5.0 V

3.3 V

ST6200C/ST6201C/ST6203C

68/100

10.5 CLOCK AND TIMING CHARACTERISTICS

Subject to general operating conditions for V

, f

OSC

, and T

10.5.1 General Timings

10.5.2 External Clock Source

Notes:
1. Data based on typical application software.
2. Time measured between interrupt event and interrupt vector fetch.

c(INST)

is the number of t

CPU

cycles needed to finish

the current instruction execution.

Figure 43. Typical Application with an External Clock Source

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

c(INST)

Instruction cycle time

CPU

=8 MHz

3.25

6.5

8.125

v(IT)

Interrupt reaction time

v(IT)

c(INST)

+ 6

CPU

=8 MHz

9.75

17.875

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

OSCINH

OSC

input pin high level voltage

See

Figure 43

0.7xV

OSCINL

OSC

input pin low level voltage

0.3xV

OSCx Input leakage current

± 2

OSC

OUT

OSC

EXTERNAL

ST62XX

CLOCK SOURCE

OSCINL

OSCINH

90%

10%

Not connected

ST6200C/ST6201C/ST6203C

69/100

CLOCK AND TIMING CHARACTERISTICS (Cont'd)

10.5.3 Crystal and Ceramic Resonator Oscillators

The ST6 internal clock can be supplied with sever-
al different Crystal/Ceramic resonator oscillators.
Only parallel resonant crystals can be used. All the
information given in this paragraph are based on

characterization results with specified typical ex-
ternal components. Refer to the crystal/ceramic
resonator manufacturer for more details (frequen-
cy, package, accuracy...).

Notes:
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. t

SU(OSC)

is the typical oscillator start-up time measured between V

=2.8V and the fetch of the first instruction (with a

quick V

ramp-up from 0 to 5V (<50

s).

3. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small R

value.

Refer to crystal/ceramic resonator manufacturer for more details.

Figure 44. Typical Application with a Crystal or Ceramic Resonator

Symbol

Parameter

Conditions

Typ

Unit

Feedback resistor

Recommended load capacitances versus equiva-
lent crystal or ceramic resonator frequency

OSC

=32 kHz,

OSC

=1 MHz

OSC

=2 MHz

OSC

=4 MHz

OSC

=8 MHz

120

47
33
33
22

Oscillator

Typical Crystal or Ceramic Resonators

[pF]

SU(osc)

[ms]

Reference

Freq.

Characteristic

ramic

RATA

CSB455E

455KHz

OSC

=[±0.5KHz

tolerance

,±0.3%

±0.5%

aging

]

220 220

CSB1000J

1MHz

OSC

=[±0.5KHz

tolerance

,±0.3%

±0.5%

aging

]

100 100

CSTCC2.00MG0H6

2MHz

OSC

=[±0.5%

tolerance

,±0.5%

±0.3%

aging

]

CSTCC4.00MG0H6

4MHz

OSC

=[±0.5%

tolerance

,±0.3%

±0.3%

aging

]

CSTCC8.00MG

8MHz

OSC

=[±0.5%

tolerance

,±0.3%

±0.3%

aging

]

OSC

OUT

OSC

ST62XX

RESONATOR

OSC

ST6200C/ST6201C/ST6203C

70/100

CLOCK AND TIMING CHARACTERISTICS (Cont'd)

10.5.4 RC Oscillator

The ST6 internal clock can be supplied with an external RC oscillator. Depending on the

NET

value, the

accuracy of the frequency is about 20%, so it may not be suitable for some applications.

Notes:
1. Data based on characterization results, not tested in production. These measurements were done with the OSCin pin

unconnected (only soldered on the PCB).

2. R

NET

must have a positive temperature coefficient (ppm/°C), carbon resistors should therefore not be used.

Figure 45. Typical Application with RC Oscillator

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

OSC

RC oscillator frequency

4.5

NET

=22 k

NET

=47 k

NET

=100 k

NET

=220 k

NET

=470 k

7.2
5.1
3.2
1.8
0.9

8.6
5.7
3.4
1.9

0.95

6.5
3.8

1.1

MHz

3.6V

NET

=22 k

NET

=47 k

NET

=100 k

NET

=220 k

NET

=470 k

3.7
2.8
1.8

0.5

4.3

1.9
1.1

0.55

4.9
3.3

1.2
0.6

NET

RC Oscillator external resistor

see

Figure 46

Figure 47

870

OSC

OUT

NET

EXTERNAL RC

~9pF DISCHARGE

ST62XX

OSC

MIRROR
CURRENT

ST6200C/ST6201C/ST6203C

73/100

10.7 EMC CHARACTERISTICS

Susceptibility tests are performed on a sample ba-
sis during product characterization.

10.7.1 Functional EMS

(Electro Magnetic Susceptibility)

Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).

ESD: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.

FTB: A Burst of Fast Transient voltage (positive
and negative) is applied to V

and V

through

a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-4-
4 standard.

A device reset allows normal operations to be re-
sumed.

Notes:
1. Data based on characterization results, not tested in production.
2. The suggested 10 µF and 0.1 µF decoupling capacitors on the power supply lines are proposed as a good price vs.

EMC performance tradeoff. They have to be put as close as possible to the device power supply pins. Other EMC rec-
ommendations are given in other sections (I/Os, RESET, OSCx pin characteristics).

Figure 50. EMC Recommended Star Network Power Supply Connection

Symbol

Parameter

Conditions

Neg

Pos

Unit

FESD

Voltage limits to be applied on any I/O pin
to induce a functional disturbance

5V, T

+25°C, f

OSC

8MHz

conforms to IEC 1000-4-2

-2

FFTB

Fast transient voltage burst limits to be ap-
plied through 100pF on V

and V

pins

to induce a functional disturbance

5V, T

+25°C, f

OSC

8MHz

conforms to IEC 1000-4-4

-2.5

0.1 µF

10 µF

ST62XX

POWER
SUPPLY
SOURCE

ST6
DIGITAL NOISE
FILTERING
(close to the MCU)

ST6200C/ST6201C/ST6203C

74/100

EMC CHARACTERISTICS (Cont'd)

10.7.2 Absolute Electrical Sensitivity

Based on three different tests (ESD, LU and DLU)
using specific measurement methods, the product
is stressed in order to determine its performance in
terms of electrical sensitivity. For more details, re-
fer to the AN1181 application note.

10.7.2.1 Electro-Static Discharge (ESD)

Electro-Static Discharges (3 positive then 3 nega-
tive pulses separated by 1 second) are applied to
the pins of each sample according to each pin
combination. The sample size depends of the
number of supply pins of the device (3 parts*(n+1)
supply pin). Two models are usually simulated:
Human Body Model and Machine Model. This test
conforms to the JESD22-A114A/A115A standard.
See

Figure 51

and the following test sequences.

Human Body Model Test Sequence

is loaded through S1 by the HV pulse gener-

ator.

S1 switches position from generator to R.

A discharge from C

through R (body resistance)

to the ST6 occurs.

S2 must be closed 10 to 100ms after the pulse

delivery period to ensure the ST6 is not left in
charge state. S2 must be opened at least 10ms
prior to the delivery of the next pulse.

Machine Model Test Sequence

is loaded through S1 by the HV pulse gener-

ator.

S1 switches position from generator to ST6.

A discharge from C

to the ST6 occurs.

S2 must be closed 10 to 100ms after the pulse

delivery period to ensure the ST6 is not left in
charge state. S2 must be opened at least 10ms
prior to the delivery of the next pulse.

R (machine resistance), in series with S2, en-

sures a slow discharge of the ST6.

Absolute Maximum Ratings

Notes:
1. Data based on characterization results, not tested in production.

Figure 51. Typical Equivalent ESD Circuits

Symbol

Ratings

Conditions

Maximum value

Unit

ESD(HBM)

Electro-static discharge voltage
(Human Body Model)

+25°C

2000

ESD(MM)

Electro-static discharge voltage
(Machine Model)

+25°C

200

ST6

R=1500

HIGH VOLTAGE

100pF

PULSE

GENERATOR

ST6

HIGH VOLTAGE

200pF

PULSE

GENERATOR

R=
10k

~1
0M

HUMAN BODY MODEL

MACHINE MODEL

ST6200C/ST6201C/ST6203C

75/100

EMC CHARACTERISTICS (Cont'd)

10.7.2.2 Static and Dynamic Latch-Up

LU: 3 complementary static tests are required
on 10 parts to assess the latch-up performance.
A supply overvoltage (applied to each power
supply pin), a current injection (applied to each
input, output and configurable I/O pin) and a
power supply switch sequence are performed
on each sample. This test conforms to the EIA/
JESD 78 IC latch-up standard. For more details,
refer to the AN1181 application note.

DLU: Electro-Static Discharges (one positive
then one negative test) are applied to each pin
of 3 samples when the micro is running to
assess the latch-up performance in dynamic
mode. Power supplies are set to the typical
values, the oscillator is connected as near as
possible to the pins of the micro and the
component is put in reset mode. This test
conforms to the IEC1000-4-2 and SAEJ1752/3
standards and is described in

Figure 52

. For

more details, refer to the AN1181 application
note.

Electrical Sensitivities

Notes:
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC spec-

ifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the
JEDEC criteria (international standard).

2. Schaffner NSG435 with a pointed test finger.

Figure 52. Simplified Diagram of the ESD Generator for DLU

Symbol

Parameter

Conditions

Class

Static latch-up class

+25°C

+85°C

A
A

DLU

Dynamic latch-up class

5V, f

OSC

4MHz, T

+25°C

=50M

=330

150pF

ESD

HV RELAY

DISCHARGE TIP

DISCHARGE
RETURN CONNECTION

GENERATOR

ST6

ST6200C/ST6201C/ST6203C

76/100

EMC CHARACTERISTICS (Cont'd)

10.7.3 ESD Pin Protection Strategy

To protect an integrated circuit against Electro-
Static Discharge the stress must be controlled to
prevent degradation or destruction of the circuit el-
ements. The stress generally affects the circuit el-
ements which are connected to the pads but can
also affect the internal devices when the supply
pads receive the stress. The elements to be pro-
tected must not receive excessive current, voltage
or heating within their structure.

An ESD network combines the different input and
output ESD protections. This network works, by al-
lowing safe discharge paths for the pins subjected
to ESD stress. Two critical ESD stress cases are
presented in

Figure 53

and

Figure 54

for standard

pins.

Standard Pin Protection

To protect the output structure the following ele-
ments are added:

A diode to V

(3a) and a diode from V

(3b)

A protection device between V

and V

(4)

To protect the input structure the following ele-
ments are added:

A resistor in series with the pad (1)

A diode to V

(2a) and a diode from V

(2b)

A protection device between V

and V

(4)

Figure 53. Positive Stress on a Standard Pad vs. V

Figure 54. Negative Stress on a Standard Pad vs. V

(1)

(2a)

(2b)

(4)

OUT

(3a)

(3b)

Main path

Path to avoid

(1)

(2a)

(2b)

(4)

OUT

(3a)

(3b)

Main path

ST6200C/ST6201C/ST6203C

77/100

10.8 I/O PORT PIN CHARACTERISTICS

10.8.1 General Characteristics

Subject to general operating conditions for V

, f

OSC

, and T

unless otherwise specified.

Figure 55. Typical R

vs. V

with V

= V

Notes:
1. Unless otherwise specified, typical data are based on T

=25°C and V

=5V.

2. Data based on characterization results, not tested in production.
3. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
4. The R

pull-up equivalent resistor is based on a resistive transistor. This data is based on characterization results,

not tested in production.

5. Data based on characterization results, not tested in production.
6. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external

interrupt source.

Figure 56. Two typical Applications with unused I/O Pin

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Input low level voltage

0.3xV

Input high level voltage

0.7xV

hys

Schmitt trigger voltage hysteresis

=5V

200

400

=3.3V

200

400

Input leakage current

(no pull-up configured)

0.1

Weak pull-up equivalent resistor

=5V

110

350

=3.3V

230

700

I/O input pin capacitance

OUT

I/O output pin capacitance

f(IO)out

Output high to low level fall time

=50pF

Between 10% and 90%

r(IO)out

Output low to high level rise time

w(IT)in

External interrupt pulse time

CPU

VDD [V]

100

150

200

250

300

350

Rpu [Khom]

Ta=-40°C

Ta=25°C

Ta=95°C

Ta=125°C

10k

UNUSED I/O PORT

ST62XX

10k

UNUSED I/O PORT

ST62XX

ST6200C/ST6201C/ST6203C

78/100

I/O PORT PIN CHARACTERISTICS (Cont'd)

10.8.2 Output Driving Current

Subject to general operating conditions for V

, f

OSC

, and T

unless otherwise specified.

Notes:
1. The I

current sunk must always respect the absolute maximum rating specified in

Section 10.2.2

and the sum of I

(I/O ports and control pins) must not exceed I

VSS

2. The I

current source must always respect the absolute maximum rating specified in

Section 10.2.2

and the sum of

(I/O ports and control pins) must not exceed I

VDD

. True open drain I/O pins does not have V

Figure 57. Typical V

at V

= 5V (standard)

Figure 58. Typical V

at V

= 5V (high-sink)

Symbol

Parameter

Conditions

Min

Max

Unit

Output low level voltage for a standard I/O pin
(see

Figure 57

and

Figure 60

)

=5V

=+10µA, T

125°C

0.1

=+3mA, T

125°C

0.8

=+5mA, T

85°C

0.8

=+10mA, T

85°C

1.2

Output low level voltage for a high sink I/O pin
(see

Figure 58

and

Figure 61

)

=+10µA, T

125°C

0.1

=+7mA, T

125°C

0.8

=+10mA, T

85°C

0.8

=+15mA, T

125°C

1.3

=+20mA, T

85°C

1.3

=+30mA, T

85°C

Output high level voltage for an I/O pin
(see

Figure 59

and

Figure 62

)

=-10

A, T

125°C

-0.1

=-3mA, T

125°C

-1.5

=-5mA, T

85°C

-1.5

Iio [mA]

200

400

600

800

1000

Vol [mV] at Vdd=5V

Ta=-40°C

Ta=25°C

Ta=95°C

Ta=125°C

Iio [mA]

0.2

0.4

0.6

0.8

Vol [V] at Vdd=5V

Ta=-40°C

Ta=25°C

Ta=95°C

Ta=125°C

ST6200C/ST6201C/ST6203C

81/100

10.9 CONTROL PIN CHARACTERISTICS

10.9.1 Asynchronous RESET Pin

Subject to general operating conditions for V

, f

OSC

, and T

unless otherwise specified.

Notes:
1. Unless otherwise specified, typical data are based on T

=25°C and V

=5V.

2. Data based on characterization results, not tested in production.
3. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
4. The R

pull-up equivalent resistor is based on a resistive transistor. This data is based on characterization results,

not tested in production.

5. All short pulse applied on RESET pin with a duration below t

h(RSTL)in

can be ignored.

6. The reset network protects the device against parasitic resets, especially in a noisy environment.
7. The output of the external reset circuit must have an open-drain output to drive the ST6 reset pad. Otherwise the device

can be damaged when the ST6 generates an internal reset (LVD or watchdog).

Figure 63. Typical R

vs V

with V

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Input low level voltage

0.3xV

Input high level voltage

0.7xV

hys

Schmitt trigger voltage hysteresis

200

400

Weak pull-up equivalent resistor

=5V

150

350

900

=3.3V

300

730

1900

ESD

ESD resistor protection

=5V

2.8

=3.3V

w(RSTL)out

Generated reset pulse duration

External pin or
internal reset sources

CPU

h(RSTL)in

External reset pulse hold time

g(RSTL)in

Filtered glitch duration

VDD [V]

100

200

300

400

500

600

700

800

900

1000

Ron [Kohm]

Ta=-40°C

Ta=25°C

Ta=95°C

Ta=125°C

ST6200C/ST6201C/ST6203C

82/100

CONTROL PIN CHARACTERISTICS (Cont'd)

Figure 64. Typical Application with RESET pin

10.9.2 NMI Pin

Subject to general operating conditions for V

, f

OSC

, and T

unless otherwise specified.

Notes:
1. Unless otherwise specified, typical data are based on T

=25°C and V

=5V.

2. Data based on characterization results, not tested in production.
3. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
4. The R

pull-up

equivalent resistor is based on a resistive transistor. This data is based on characterization results, not

tested in production.

Figure 65. Typical R

pull-up

vs. V

with V

0.1

4.7k

EXTERNAL

RESET

CIRCUIT

TIO

INT

UNT

RESET

WATCHDOG RESET

LVD RESET

INTERNAL

RESET

ESD

STOP MODE

t
e

r
n

l
c

l
oc

l
es

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Input low level voltage

0.3xV

Input high level voltage

0.7xV

hys

Schmitt trigger voltage hysteresis

200

400

pull-up

Weak pull-up equivalent resistor

=5V

100

350

=3.3V

200

700

VDD [V]

100

150

200

250

300

Rpull-up [Kohm]

Ta=-40°C

Ta=25°C

Ta=95°C

Ta=125°C

ST6200C/ST6201C/ST6203C

84/100

10.11 8-BIT ADC CHARACTERISTICS

Subject to general operating conditions for V

, f

OSC

, and T

unless otherwise specified.

Notes:
1. Unless otherwise specified, typical data are based on T

=25°C and V

=5V.

2. The ADC refers to V

and V

3. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10k

). Data

based on characterization results, not tested in production.

4. As a stabilization time for the AD converter is required, the first conversion after the enable can be wrong.

Figure 66. Typical Application with ADC

Note: ADC not present on some devices. See device summary on page 1.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

OSC

Clock frequency

1.2

OSC

MHz

AIN

Conversion range voltage

AIN

External input resistor

ADC

Total convertion time

OSC

=8MHz

OSC

=4MHz

140

STAB

Stabilization time

CPU

OSC

=8MHz

3.25

6.5

µs

Analog input current during conver-
sion

1.0

µA

Analog input capacitance

AINx

ST62XX

AIN

10pF

ADC

10M

150

ST6200C/ST6201C/ST6203C

85/100

8-BIT ADC CHARACTERISTICS (Cont'd)

ADC Accuracy

Notes:
1. Negative injection disturbs the analog performance of the device. In particular, it induces leakage currents throughout

2. Data based on characterization results over the whole temperature range, monitored in production.

Figure 67. ADC Accuracy Characteristics

Note: ADC not present on some devices. See device summary on page 1.

Symbol

Parameter

Conditions

Min

Typ.

Max

Unit

Total unadjusted error

=5V

OSC

=8MHz

1.2

2, fosc>1.2MHz

4, fosc>32KHz

LSB

Offset error

0.72

Gain Error

-0.31

Differential linearity error

0.54

Integral linearity error

1 LSB

IDEAL

1LSB

IDE AL

DDA

SSA

256

-----------------------------------------

(LSB

IDEAL

)

(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line

=Total Unadjusted Error: maximum deviation

between the actual and the ideal transfer curves.
E

=Offset Error: deviation between the first actual

transition and the first ideal one.
E

=Gain Error: deviation between the last ideal

transition and the last actual one.
E

=Differential Linearity Error: maximum deviation

between actual steps and the ideal one.
E

=Integral Linearity Error: maximum deviation

between any actual transition and the end point
correlation line.

Digital Result ADCDR

255

254

253

253 254 255 256

(1)

(2)

(3)

DDA

SSA

ST6200C/ST6201C/ST6203C

86/100

11 GENERAL INFORMATION

11.1 PACKAGE MECHANICAL DATA

Figure 68. 16-Pin Plastic Dual In-Line Package, 300-mil Width

Figure 69. 16-Pin Plastic Small Outline Package, 300-mil Width

Dim.

inches

Min

Typ

Max

Min

Typ

Max

5.33

0.210

0.38

0.015

2.92

3.30

4.95 0.115 0.130 0.195

0.36

0.46

0.56 0.014 0.018 0.022

1.14

1.52

1.78 0.045 0.060 0.070

0.76

0.99

1.14 0.030 0.039 0.045

0.20

0.25

0.36 0.008 0.010 0.014

18.67 19.18 19.69 0.735 0.755 0.775

0.13

0.005

2.54

0.100

7.62

7.87

8.26 0.300 0.310 0.325

6.10

6.35

7.11 0.240 0.250 0.280

2.92

3.30

3.81 0.115 0.130 0.150

10.92

0.430

Number of Pins

Dim.

inches

Min

Typ

Max

Min

Typ

Max

2.35

2.65 0.093

0.104

0.10

0.30 0.004

0.012

0.33

0.51 0.013

0.020

0.23

0.32 0.009

0.013

10.10

10.50 0.398

0.413

7.40

7.60 0.291

0.299

10.00

10.65 0.394

0.419

1.27

0.050

0.25

0.75 0.010

0.030

0°

8°

0°

8°

0.40

1.27 0.016

0.050

Number of Pins

h x 45×

ST6200C/ST6201C/ST6203C

87/100

PACKAGE MECHANICAL DATA (Cont'd)

Figure 70. 16-Pin Ceramic Side-Brazed Dual In-Line Package

Figure 71. 16-Pin Plastic Shrink Small Outline Package

Dim.

inches

Min

Typ

Max

Min

Typ

Max

3.78

0.149

0.38

0.015

0.36 0.46 0.56 0.014 0.018 0.022

1.14 1.37 1.78 0.045 0.054 0.070

0.20 0.25 0.36 0.008 0.010 0.014

19.86 20.32 20.78 0.782 0.800 0.818

17.78

0.700

7.04 7.49 7.95 0.277 0.295 0.313

2.54

0.100

6.35 6.60 6.86 0.250 0.260 0.270

9.47 9.73 9.98 0.373 0.383 0.393

1.02

0.040

2.92 3.30 3.81 0.115 0.130 0.150

1.27

0.050

4.22

0.166

Number of Pins

CDIP16W

Dim.

inches

Min

Typ

Max

Min

Typ

Max

2.00

0.079

0.05

0.002

1.65

1.75

1.85 0.065 0.069 0.073

0.22

0.38 0.009

0.015

0.09

0.25 0.004

0.010

5.90

6.20

6.50 0.232 0.244 0.256

7.40

7.80

8.20 0.291 0.307 0.323

5.00

5.30

5.60 0.197 0.209 0.220

0.65

0.026

0°

4°

8°

0°

4°

8°

0.55

0.75

0.95 0.022 0.030 0.037

Number of Pins

ST6200C/ST6201C/ST6203C

92/100

11.6 TRANSFER OF CUSTOMER CODE

Customer code is made up of the ROM contents
and the list of the selected FASTROM options.
The ROM contents are to be sent on diskette, or
by electronic means, with the hexadecimal file
generated by the development tool. All unused
bytes must be set to FFh.

The selected options are communicated to
STMicroelectronics using the correctly filled OP-
TION LIST appended. See

page 94

The STMicroelectronics Sales Organization will be
pleased to provide detailed information on con-
tractual points.

Listing Generation and Verification. When
STMicroelectronics receives the user's ROM con-
tents, a computer listing is generated from it. This
listing refers exactly to the ROM contents and op-
tions which will be used to produce the specified
MCU. The listing is then returned to the customer
who must thoroughly check, complete, sign and
return it to STMicroelectronics. The signed listing
forms a part of the contractual agreement for the
production of the specific customer MCU.

11.6.1 FASTROM version

The ST62P00C, P01C and P03C are the Factory
Advanced Service Technique ROM (FASTROM)
versions of ST62T00C, T01 and T03C OTP devic-
es.

They offer the same functionality as OTP devices,
but they do not have to be programmed by the
customer. The customer code must be sent to
STMicroelectronics in the same way as for ROM
devices. The FASTROM option list has the same
options as defined in the programmable option
byte of the OTP version. It also offers an identifier
option. If this option is enabled, each FASTROM
device is programmed with a unique 5-byte
number which is mapped at addresses 0F9Bh-
0F9Fh. The user must therefore leave these bytes
blanked.

The identification number is structured as follows:

with T0, T1, T2, T3 = time in seconds since 01/01/
1970 and Test ID = Tester Identifier.

0F9Bh

0F9Ch

0F9Dh

0F9Eh

0F9Fh

Test ID

ST6200C/ST6201C/ST6203C

94/100

TRANSFER OF CUSTOMER CODE (Cont'd)

ST6200C/01C/03C/P00C/P01C/P03C MICROCONTROLLER OPTION LIST

Customer:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Address:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contact:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Phone:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Reference:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

STMicroelectronics references:

Device:

[ ] ST6200C (1 KB)

[ ] ST62P00C (1 KB)

[ ] ST6201C (2 KB)

[ ] ST62P01C (2 KB)

[ ] ST6203C (1 KB)

[ ] ST62P03C (1 KB)

Package:

[ ] Dual in Line Plastic
[ ] Small Outline Plastic with conditioning
[ ] Shrink Small Outline Plastic with conditioning

Conditioning option:

[ ] Standard (Tube)
[ ] Tape & Reel

Temperature Range:

[ ] 0°C to + 70°C

[ ] - 40°C to + 85°C

[ ] - 40°C to + 125°C

Marking:

[ ] Standard marking
[ ] Special marking (ROM only):

PDIP16 (9 char. max): _ _ _ _ _ _ _ _ _
SO16 (6 char. max): _ _ _ _ _ _
SSOP16 (10 char. max): _ _ _ _ _ _ _ _ _ _

Authorized characters are letters, digits, '.', '-', '/' and spaces only.

Oscillator Safeguard:

[ ] Enabled

[ ] Disabled

Watchdog Selection:

[ ] Software Activation
[ ] Hardware Activation

NMI pull-up:

[ ] Enabled

[ ] Disabled

Oscillator Selection:

[ ] Quartz crystal / Ceramic resonator
[ ] RC network

Readout Protection:

FASTROM:

[ ] Enabled

[ ] Disabled

ROM:

[ ] Enabled:

[ ] Fuse is blown by STMicroelectronics

[ ] Fuse can be blown by the customer

[ ] Disabled

Low Voltage Detector:

[ ] Enabled

[ ] Disabled

External STOP Mode Control:

[ ] Enabled

[ ] Disabled

Identifier (FASTROM only):

[ ] Enabled

[ ] Disabled

Comments:

Oscillator Frequency in the application:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply Operating Range in the application:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Notes:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Date:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signature:

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ST6200C/ST6201C/ST6203C

95/100

12 DEVELOPMENT TOOLS

STMicroelectronics offers a range of hardware
and software development tools for the ST6 micro-
controller family. Full details of tools available for
the ST6 from third party manufacturers can be ob-

tain from the STMicroelectronics Internet site:

http://mcu.st.com.

Table 24. Dedicated Third Parties Development Tools

Note 1: For latest information on third party tools, please visit our Internet site:

http://mcu.st.com.

Third Party

Designation

ST Sales Type

Web site address

ACTUM

ST-REALIZER II: Graphical Schematic
based Development available from
STMicroelectronics.

STREALIZER-II

http://www.actum.com/

CEIBO

Low cost emulator available from CEI-
BO.

http://www.ceibo.com/

RAISONANCE

This tool includes in the same environ-
ment: an assembler, linker, C compiler,
debugger and simulator. The assembler
package (plus limited C compiler) is free
and can be downloaded from raisonance
web site. The full version is available
both from STMicroelectronics and Raiso-
nance.

ST6RAIS-SWC/

http://www.raisonance.com/

SOFTEC

High end emulator available from
SOFTEC.

http://www.softecmicro.com/

Gang programmer available from
SOFTEC.

ADVANCED EQUIPMENT

Single and gang programmers

http://www.aec.com.tw/

ADVANCED TRANSDATA

http://www.adv-transdata.com/

BP MICROSYSTEMS

http://www.bpmicro.com/

DATA I/O

http://www.data-io.com/

DATAMAN

http://www.dataman.com/

EE TOOLS

http://www.eetools.com/

ELNEC

http://www.elnec.com/

HI-LO SYSTEMS

http://www.hilosystems.com.tw/

ICE TECHNOLOGY

http://www.icetech.com/

LEAP

http://www.leap.com.tw/

LLOYD RESEARCH

http://www.lloyd-research.com/

LOGICAL DEVICES

http://www.chipprogram-

mers.com/

MQP ELECTRONICS

http://www.mqp.com/

NEEDHAMS

ELECTRONICS

http://www.needhams.com/

STAG PROGRAMMERS

http://www.stag.co.uk/

SYSTEM GENERAL CORP

http://www.sg.com.tw

TRIBAL MICROSYSTEMS

http://www.tribalmicro.com/

XELTEK

http://www.xeltek.com/

ST6200C/ST6201C/ST6203C

96/100

DEVELOPMENT TOOLS (Cont'd)

STMicroelectronics Tools

Four types of development tool are offered by ST, all of them connect to a PC via a parallel or serial port:
see

Table 25

and

Table 26

for more details.

Table 25. STMicroelectronics Tool Features

Table 26. Dedicated STMicroelectronics Development Tools

Emulation Type

Programming Capability

Software Included

ST6 Starter Kit

Device simulation (limited
emulation as interrupts are
not supported)

Yes (DIP packages only)

MCU CD ROM with:

Rkit-ST6 from Raisonance
ST6 Assembly toolchain
WGDB6 powerful Source Level

Debugger for Win 3.1, Win 95
and NT

Various software demo ver-

sions.

Windows Programming Tools

for Win 3.1, Win 95 and NT

ST6 HDS2 Emulator

In-circuit powerful emula-
tion features including
trace/ logic analyzer

ST6 EPROM
Programmer Board

Yes (All packages except
SSOP)

Supported Products

ST6 Starter Kit

ST6 HDS2 Emulator

ST6 Programming Board

ST6200C, 001C and 003C

ST622XC-KIT

Complete:

ST62GP-EMU2

Dedication board:

ST62GP-DBE

ST62E2XC-EPB

ST6200C/ST6201C/ST6203C

97/100

13 ST6 APPLICATION NOTES

IDENTIFICATION

DESCRIPTION

MOTOR CONTROL

AN392

MICROCONTROLLER AND TRIACS ON THE 110/240V MAINS

AN414

CONTROLLING A BRUSH DC MOTOR WITH AN ST6265 MCU

AN416

SENSORLESS MOTOR DRIVE WITH THE ST62 MCU + TRIAC

AN422

IMPROVES UNIVERSAL MOTOR DRIVE

AN863

IMPROVED SENSORLESS CONTROL WITH THE ST62 MCU FOR UNIVERSAL MOTOR

BATTERY MANAGEMENT

AN417

FROM NICD TO NIMH FAST BATTERY CHARGING

AN433

ULTRA FAST BATTERY CHARGER USING ST6210 MICROCONTROLLER

AN859

AN INTELLIGENT ONE HOUR MULTICHARGER FOR Li-Ion, NiMH and NiCd BATTERIES

HOME APPLIANCE

AN674

MICROCONTROLLERS IN HOME APPLIANCES: A SOFT REVOLUTION

AN885

ST62 MICROCONTROLLERS DRIVE HOME APPLIANCE MOTOR TECHNOLOGY

GRAPHICAL DESIGN

AN676

BATTERY CHARGER USING THE ST6-REALIZER

AN677

PAINLESS MICROCONTROLLER CODE BY GRAPHICAL APPLICATION DESCRIPTION

AN839

ANALOG MULTIPLE KEY DECODING USING THE ST6-REALIZER

AN840

CODED LOCK USING THE ST6-REALIZER

AN841

A CLOCK DESIGN USING THE ST6-REALIZER

AN842

7 SEGMENT DISPLAY DRIVE USING THE ST6-REALIZER

COST REDUCTION

AN431

USING ST6 ANALOG INPUTS FOR MULTIPLE KEY DECODING

AN594

DIRECT SOFTWARE LCD DRIVE WITH ST621X AND ST626X

AN672

OPTIMIZING THE ST6 A/D CONVERTER ACCURACY

AN673

REDUCING CURRENT CONSUMPTION AT 32KHZ WITH ST62

DESIGN IMPROVEMENTS

AN420

EXPANDING A/D RESOLUTION OF THE ST6 A/D CONVERTER

AN432

USING ST62XX I/O PORTS SAFELY

AN434

MOVEMENT DETECTOR CONCEPTS FOR NOISY ENVIRONMENTS

AN435

DESIGNING WITH MICROCONTROLLERS IN NOISY ENVIRONMENTS

AN669

SIMPLE RESET CIRCUITS FOR THE ST6

AN670

OSCILLATOR SELECTION FOR ST62

AN671

PREVENTION OF DATA CORRUPTION IN ST6 ON-CHIP EEPROM

AN911

ST6 MICRO IS EMC CHAMPION

AN975

UPGRADING FROM ST625X/6XB TO ST625X/6XC

AN1015

SOFTWARE TECHNIQUES FOR IMPROVING ST6 EMC PERFORMANCE

PERIPHERAL OPERATIONS

AN590

PWM GENERATION WITH ST62 AUTO-RELOAD TIMER

AN591

INPUT CAPTURE WITH ST62 AUTO-RELOAD TIMER

AN592

PLL GENERATION USING THE ST62 AUTO-RELOAD TIMER

AN593

ST62 IN-CIRCUIT PROGRAMMING

AN678

LCD DRIVING WITH ST6240

ST6200C/ST6201C/ST6203C

99/100

14 SUMMARY OF CHANGES

Description of the changes between the current release of the specification and the previous one.

15 TO GET MORE INFORMATION

To get the latest information on this product please use the STMicroelectronics web server.

http://mcu.st.com/

Revision

Main Changes

Date

3.1

Pinout: Pin 10, TEST function is changed to non-user info. See

Figure 2

Modification of Caution in

Section 3.1.6.1

Addition of power consumption information in

Section 3.3

Addition of Note in

Section 7.2.4

Modification of text (READ-MODIFY-WRITE instructions) in

Section 7.2.5

Modification of

Section 8.2

: 8-Bit Timer. Ext. Timer pin is not available.

Modification of bit names in ADCR and ADR registers in

Section 8.3

Modification of Electrical Characteristics in

Section 10.2.1

(Add. of V

OUT

) and in

Section

10.5.2

(Del. of tw and tr).

15 Jan 2001

3.2

Removed "TEST" in

Figure 1

Updated

Table 2 on page 11

: CPU added for 0C8h and ROM added for 0C9h.

Changed bits 5:0 to bits 7:2 for T[5:0] bits (WDGR register on

Section 8.1.7 on page 44

)

Changed 4.5V

5.5V to 4.5V

6.0V (

Section 10 on page 58

Added one note on RC oscillator (

Section 10.5.4 on page 70

Changed

Figure 46

title on

page 71

(vs V

instead of vs R

NET

Updated Electrical Sensitivities table on

page 75

Changed

Section 11.6.1 on page 92

Changed option list (

page 94

Updated

Section 12 on page 95

and

Section 13 on page 97

July 2001

ST6200C/ST6201C/ST6203C

100/100

NOTES:

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without the express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics

Purchase of I

C Components by STMicroelectronics conveys a license under the Philips I

C Patent. Rights to use these components in an

C system is granted provided that the system conforms to the I

C Standard Specification as defined by Philips.

STMicroelectronics Group of Companies

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http://www.st.com

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: ST62E01C

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: ST62E01C